10 Layers Buried Resistance ENIG+Hard Gold (Gold Finger) POFV Multilayer PCB
- Layers10 Layers (Max 64 Layers)
- Base materialTU 768
- Finished thickness2.0 mm (Max 8mm)
Knowledge base
At PCB (Printed Circuit Board) design and manufacturing facilities, substrate material selection plays a vital role in determining board performance, durability and application. From traditional materials like FR-4 to advanced Ceramic PCBs – this article explores various options and their impacts.
Fiberglass Reinforced Epoxy Laminates, more commonly referred to as FR-4, are the go-to substrate material for PCB manufacturing applications due to its ease of production, good thermal properties and competitive pricing. FR-4 provides outstanding general application performance making it the go-to choice in consumer electronics manufacturing applications.
Aluminum-backed PCBs, known as metal core PCBs (MCPCB), are popular choices when heat dissipation is key to an application’s performance and reliability. LED PCBs, power converters and automotive systems often rely on aluminum to enhance reliability and longevity.
Designers seeking high-temperature resistance and mechanical stability often opt for Polyimide as it has excellent thermal endurance properties that make it suitable for aerospace and military applications. While more costly than FR-4, Polyimide makes for excellent use in military or aerospace settings.
When it comes to high-frequency applications such as microwave, RF and antenna use, Teflon is often the go-to material due to its low dielectric constant and superior chemical resistance – making it the go-to material in such circumstances.
While not yet commonplace, ceramic PCBs have increasingly gained favor for high frequency and temperature applications, offering superior thermal conductance, electrical insulation, mechanical strength and cost.
Rogers material is another high-frequency application substrate with excellent dielectric constant and moisture tolerance characteristics that makes it suitable for wireless communications and complex multilayer designs.
Selecting the material used for PCB boards can have an enormous effect on their thermal, mechanical, and electrical properties. Therefore it’s crucial to select one that satisfies device-specific application, environment, and performance requirements. As our understanding of materials improves and more substances become available it will be fascinating to witness how advances will shape future PCB designs and applications.
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Production builds from the Multilayer PCB category.
Send the stack-up or the Gerber set and an engineer will tell you how the theory above lands inside our process window.