14 boards in this category
When the heat has to leave through the board, the base metal and the bonding method matter more than the copper weight.
Ranges below are computed from the 14 boards listed on this page, not from a marketing sheet.
| Built to | Range across this category |
|---|---|
| Layer counts built | 1–2 |
| Base materials | 3.0 High Thermal Conductivity Aluminum Based, Aluminum-Based, BERGQUIST Aluminum-Based, Copper-Based, Iron-Based |
| Surface finishes | ENIG 1u, HASL Lead-Free, OSP |
| Solder mask colours | Black, Green, White |
| Special processes | Buried Capacitance, Thermoelectric Separation |
| Finished thickness | 0.5–3.0 mm |
Send Gerber plus a drill file and a stack-up note. Quotation comes back within 6 hours, with DFM comments attached.
