Process capability
PCB fabrication capability, standard to innovative
The three columns are the plant's own process tiers. Standard is routine work, advanced needs a tooling review, innovative is quoted case by case. Nothing here is aspirational — these are the windows production runs to.
General parameters
| Item | Standard | Advanced | Innovative |
|---|---|---|---|
| IC space (green solder mask) | 4 | 4 | 3 |
| IC space (other colours) | 5 | 5 | 4 (blue oil) |
| LPI solder mask registration | 3 mil | 2 mil | 1.5 mil |
| Thickness tolerance (T > 1.0 mm) | ±10% | ±8% | ±5% |
| Thickness tolerance (T ≤ 1.0 mm) | ±0.1 mm | ±0.1 mm | ±0.05 mm |
| Board thickness | 0.5–5.0 mm | 0.25–6.5 mm | 0.1–10 mm |
| Hole aspect ratio | 10:1 | 12:1 | 20:1 |
| Via size for solder mask plug | 0.25–0.5 mm | 0.20–0.5 mm | 0.15–0.6 mm |
| Via size for resin plug and capped copper | 0.25–0.5 mm | 0.20–0.5 mm | 0.075–0.6 mm |
| Panel size | 457 × 609 mm | 457 × 609 mm | 609 × 1200 mm |
| Bow and twist | ≤ 0.75% | ≤ 0.75% | ≤ 0.5% |
Inner layer graphics — minimum line width / space (mil)
| Base copper | Line width / space |
|---|---|
| 1/3 oz | 2 / 2 |
| 0.5 oz | 2.5 / 2.5 |
| 1.0 oz | 3 / 3 |
| 2.0 oz | 5 / 5 |
| 3.0 oz | 7 / 7 |
| 4.0 oz | 9 / 9 |
| 5.0 oz | 10 / 16 |
| 6.0 oz | 10 / 10.5 |
| 10 oz | 18 / 20 |
| 12 oz | 22 / 24 |
| Hole-to-line spacing | 4 layers ≥ 3 mil · 6 layers ≥ 5 mil · 8 layers ≥ 7 mil · 10+ layers ≥ 7 mil |
| Line width / space accuracy | Non-impedance ±20% · impedance ±10% |
| Alignment accuracy | ±25 μm (CCD) |
Outer layer graphics — minimum line width / space (mil)
| Base copper | Line width / space |
|---|---|
| 1/3 oz | 2.5 / 2.5 |
| 0.5 oz | 2.8 / 2.8 |
| 1.0 oz | 3 / 3 |
| 2.0 oz | 5 / 5.5 |
| 3.0 oz | 6 / 7.5 |
| 4.0 oz | 14 / 12 |
| 5.0 oz | 18 / 17 |
| 6.0 oz | 13 / 11 |
| 10 oz | 16 / 26 |
| 12 oz | 24 / 32 |
| Minimum etched text line width | H oz: 8 mil · 1 oz: 10 mil · 2 oz: 12 mil |
| Alignment accuracy | ≤ 24 μm (LDI) |
Hole processing
| Item | Mass production | Prototyping |
|---|---|---|
| Through hole diameter (max) | 6.5 mm (above 6.5 mm by hole expansion process) | — |
| Through hole diameter (min) | 0.15 mm | 0.15 mm |
| Hole tolerance | NPTH ±0.05 mm · PTH ±0.075 mm · crimping ±0.05 mm | ±0.05 mm |
| Thickness ratio | 8:1 | 20:1 |
| Minimum hole spacing | Same grid > 8 mil · non-same grid ≥ 12 mil | Same grid ≥ 6 mil · non-same grid ≥ 10 mil |
| Depth control hole diameter (min) | 0.155 mm | 0.155 mm |
| Depth control accuracy | 0.1 mm | 0.05 mm |
| Laser hole copper | ≥ 10 μm | ≥ 10 μm |
| Laser hole diameter range | 0.1–0.15 mm | 0.076–0.15 mm |
| Laser blind hole thickness-to-diameter ratio | ≤ 0.6:1 | ≤ 0.8:1 |
| Laser blind hole dielectric thickness | 2.5–4 mil | 2.5–5 mil |
| Backdrill depth tolerance | ±0.1 mm | ±0.1 mm |
| Backdrill position tolerance | ±0.1 mm | ±0.1 mm |
| Backdrill hole to outer line | ≥ 0.15 mm | ≥ 0.125 mm |
| Backdrill hole to inner line | ≥ 0.175 mm | ≥ 0.15 mm |
| Minimum slot | 0.5 mm | 0.5 mm |
Outline
| Item | Mass production | Prototyping |
|---|---|---|
| V-cut angle | 20° / 30° / 45° / 60° | 20° / 30° / 45° / 60° |
| V-cut jumping knife distance | ≥ 8 mm | ≥ 8 mm |
| V-cut board thickness | 0.4–3.0 mm | 0.4–3.0 mm |
| V-cut thickness accuracy | ±0.1 mm | ±0.05 mm |
| Minimum router cutter diameter | 0.6 mm | 0.6 mm |
| Depth-routed plate thickness | ≥ 0.4 mm | ≥ 0.4 mm |
| Depth-routed depth tolerance | ±0.15 mm | ±0.1 mm |
| Depth-routed size tolerance | ±0.13 mm | ±0.13 mm |
| Bevel (hypotenuse) angle | 20° / 30° / 45°, tolerance ±5° | usually 30° |
Surface treatment
| Finish | Standard | Advanced | Innovative |
|---|---|---|---|
| ENIG nickel thickness | 2.0–5.0 μm | 3.0–5.0 μm | 3.8–7.62 μm |
| ENIG gold thickness | 1.0–2.0 μin | 2.0–3.0 μin | 3.0–5.0 μin |
| Hard gold — normal gold finger | 0.15 μm | 0.8 μm | 3.0 μm |
| Hard gold — selective | 0.15 μm | 0.8 μm | 2.0 μm |
| ENEPIG | Ni 2.0–5.0 μm | Pd 4.0–20.0 μin | Au 1.0–5.0 μin |
| Plated gold | Ni 2.0–7.62 μm | Au 1.0–5.0 μin | |
| Immersion tin | 0.8–1.2 μm | ||
| Immersion silver | 0.15–0.4 μm | ||
| OSP | 0.2–0.6 μm | ||
| Tin-lead HASL | 2.0–40.0 μm | ||
| Lead-free HASL | 2.0–40.0 μm |
Notes and limits
HASL panels must be ≤ 500 × 600 mm and ≥ 0.6 mm thick. Other special materials can be processed from customer-supplied stock or purchased to order.
Accepted file formats
Gerber (RS-274X), PowerPCB, CAD, AutoCAD, OrCAD, P-CAD, CAM-350, CAM2000
Quotation
Within 6 hours during office hours, with DFM comments. Expedited 1–2 layer samples in as little as 8 hours.
Solder mask
KuangShun and TAIYO liquid photoimageable mask, registration to 1.5 mil on the innovative tier.
Design sitting on the edge of the window?
That is the conversation worth having before tooling. Send the stack-up and the impedance targets and we will tell you what is achievable and what it costs.