CSP, FC-BGA, SiP carriers
Substrate and Substrate-Like PCB
IC carriers are a different discipline: line geometry in microns, solder mask registration in tens of microns, and flatness measured across the whole panel.
Published capability limits
- CSP / FC-CSP / SiP / FC-BGA / WB-CSP
- FR4 / BT / high-speed material
- Trace width and space 12 / 12 μm
- Solder mask registration ±20 μm
- Strict solder mask flatness control ≤ 5 μm
Categories that sit inside this window
1 catalogue categories, 9 boards in total.
Representative builds
SUB PCB
EM-526 6 Layers 0.5mm Thickness Hoz ENEPIG Advanced BGA Substrate PCB
- Layers6 Layers (Max 64 Layers)
- Base materialEM-526
- Finished thickness0.5 mm (Max 8mm)
Substrate and Substrate-Like PCB quoted in 6 hours
Gerber plus a stack-up note is enough to start. If the design sits outside the window above, we will say so and propose the change that brings it back in.