Ceramic, glass, hybrid
Specialty PCB and Special Processes
The processes that usually force a second supplier — ceramic and glass bases, buried passives, step slots, segmented gold fingers — run on our own lines.
Published capability limits
- Ceramic and glass material
- Hybrid material lamination
- Buried capacitance / resistance
- PTH and NPTH step slots
- Uneven / segmented / step gold finger
Categories that sit inside this window
10 catalogue categories, 59 boards in total.
Representative builds
Multilayer PCB
10 Layers Buried Resistance ENIG+Hard Gold (Gold Finger) POFV Multilayer PCB
- Layers10 Layers (Max 64 Layers)
- Base materialTU 768
- Finished thickness2.0 mm (Max 8mm)
Ceramic PCB
Ceramic-Based Laser Cutting Immersion Gold 2u 1.0mm Thickness Double Side PCB
- Layers2 Layers (Max 64 Layers)
- Base materialCeramic Based
- Finished thickness1.0 mm (Max 8mm)
Glass PCB
0.6mm Thickness Laser Drilling & Laser Cutting Double Side Clear Glass PCB
- Layers2 Layers (Max 64 Layers)
- Base materialGlass
- Finished thickness0.6 mm (Max 8mm)
HDI PCB
High TG ISOLA 370HR 8 Layers Buried Via(L4-L5) Edge Plating Blue HDI PCB
- Layers8 Layers (Max 64 Layers)
- Base materialISOLA 370HR
- Finished thickness1.6 mm (Max 8mm)
Specialty PCB and Special Processes quoted in 6 hours
Gerber plus a stack-up note is enough to start. If the design sits outside the window above, we will say so and propose the change that brings it back in.