8 boards in this category

Blind/Buried Via manufacturer

Sequential lamination decides which nets can be routed at all. These structures are released for mass production, not just prototype runs.

Blind/Buried Via built by PEAK PCB in Shenzhen

Process window

  • Blind / buried / hybrid via
  • 5+N(N+M)+5 structure
  • Trace width and spacing 1.6 / 1.6 mil
  • Laser hole size ≥ 0.075 mm
  • High density interconnector
HDI PCB detail

What this category was actually built to

Ranges below are computed from the 8 boards listed on this page, not from a marketing sheet.

Built toRange across this category
Layer counts built6–12
Base materialsFR4 TG150, FR4 TG170, ISOLA 370HR, Ro4835+FR4 IT180A, Rogers Ro3003, Rogers Ro3003+ISOLA 370HR
Surface finishesENIG 1u, Immersion Silver
Solder mask coloursBlue, Green, Matte Black, Red
Special processesBlind Via, Blind Via (L1-L2), Buried Via (L3-L4), Edge Plating & Buried Via, POFV
Finished thickness1.2–2.4 mm

8 Blind/Buried Via builds

Need blind/buried via quoted?

Send Gerber plus a drill file and a stack-up note. Quotation comes back within 6 hours, with DFM comments attached.