Plant and equipment
What is on the floor
Two production bases totalling 54,000 m², with fabrication and assembly under the same roof. Sixteen years of lamination experience is what makes 64-layer pressing routine rather than an experiment.
Photographed on the line
Fabrication stations
- Drilling machine
- Inner layer etching
- AOI scanning
- CNC
- Cold and heat shock
- Impedance tester
- Clean room
- Copper sinking line
- Auto-development
- Graphic plating
- Flying probe tester
- Copper foil tensile tester
- Hole copper tester
- Laboratory
- Palm fiber line
- Automatic laminator
- Screen printing
- Water washing
- Strong peel tester
- Hundredfold loupe
- Silkscreen workshop
- Plate grinding
- Exposure machine
- Press board furnace
- Vacuum packaging
- Halogen tester
- Slicing analysis
- Test workshop
Assembly and test stations
- AOI optical detector
- Drop test
- X-ray
- Assembly welding
- Vibration testing
- Wave soldering
- DIP line
- Patch welding
- High temperature box
- Silk printer
- Reflow oven
- Solder paste printer
Assembly standard
SMT and through-hole assembly are released to IPC-A-610 Class II, with 100% AOI plus ICT and FCT testing, component pitch down to 0.15 mm and solder paste printing accuracy of ±0.025 mm.
Want to audit the plant?
Customer audits and video walkthroughs of both Shenzhen bases can be arranged — ask for a slot and the scope you need to see.