4 boards in this category

3+N+3 Structure manufacturer

Sequential lamination decides which nets can be routed at all. These structures are released for mass production, not just prototype runs.

3+N+3 Structure built by PEAK PCB in Shenzhen

Process window

  • Blind / buried / hybrid via
  • 5+N(N+M)+5 structure
  • Trace width and spacing 1.6 / 1.6 mil
  • Laser hole size ≥ 0.075 mm
  • High density interconnector
HDI PCB detail

What this category was actually built to

Ranges below are computed from the 4 boards listed on this page, not from a marketing sheet.

Built toRange across this category
Layer counts built10–18
Base materialsFR4 IT180A, FR4 TG170
Surface finishesENIG 1u
Solder mask coloursBlue, Green, Matte Green
Special processesBlind/Buried Via, Buried Capacitance
Finished thickness2.0–3.6 mm

4 3+N+3 Structure builds

Need 3+n+3 structure quoted?

Send Gerber plus a drill file and a stack-up note. Quotation comes back within 6 hours, with DFM comments attached.