Glass PCB
Built as a 2-layer stack on a glass substrate, this board leaves the line at 0.6 mm thickness under No. The demanding part of this build is copper geometry held to 2.0 mil line width and 18.0 mil spacing, mechanical holes from 0.1 mm, finished copper at ½ oz / ½ oz. Every panel is released on 100% AOI, ICT and FCT testing to IPC-A-610 E Class II, holding outline by Rout / V-cut / Bridge / Stamp Hole. Typical end use is electronic device.
Quotation within 6 hours. Gerber, PowerPCB, CAD, AutoCAD, OrCAD, P-CAD, CAM-350 and CAM2000 files accepted.
This part is 2-layer; the same presses run 1 to 64 layers, so a stack-up revision does not force a supplier change.
Built on Glass — glass substrate — drawn from over 120 laminate types held in the warehouse, from KB and ITEQ through Rogers, Isola and Panasonic.
Etched to 2.0 mil width and 18.0 mil spacing here; the process floor is 2/2 mil inner at 1/3 oz copper, with ±10% accuracy on impedance layers.
Finished with No. ENIG 1–3 μin, ENEPIG, hard gold to 3.0 μm, immersion silver, immersion tin, OSP and lead-free HASL are all in-house.
Drilling covers 0.15 mm mechanical and 0.076 mm laser holes, backdrill to ±0.1 mm and depth control to 0.05 mm.
These are the parameters this part was quoted, tooled and shipped against.
| Parameter | Value |
|---|---|
| PCB Type | Glass PCB |
| Number of Layers | 2 Layers (Max 64 Layers) |
| Finished Thickness | 0.6 mm (Max 8mm) |
| Base Material | Glass |
| Copper Thickness | 0 oz |
| Min. Hole | 0.1 mm (Min 0.1mm) |
| Min. Line Width | 2.0 mil (Min 2mil) |
| Min. Line Spacing | 18.0 mil (Min 2mil) |
| Surface Finishing | No |
| Solder Mask | No |
| Silk Screen | No |
| Thickness Tolerance | ±5% |
| Impedance Control Accuracy | 0% (min±5%) |
| Testing Service | 100% AOI ICT FCT Testing |
| Special Processes | No |
| PCB Standard | IPC-A-610 E Class II |
| Brand Name | PEAK PCB |
| Place of Origin | Shenzhen, Guangdong, China |
| Packaging Inner | Vacuum Packing/ Anti-Static Package |
| Packaging Outer | Export Carton/ Customizable |
| Port | Shenzhen,Hongkong |
| Supply Ability | Sample and Mass Production |
| Finished Inner Copper Thickness | 0oz (Max 14oz) |
| Finished Outer Copper Thickness | 0oz (Max 14oz) |
| Outline Profile | Rout/ V-cut/ Bridge/ Stamp Hole |
| Application | Electronic Device |
| Acceptable File Format | Gerber file, Powerpcb, CAD, AUTOCAD, ORCAD, P-CAD, CAM-350, CAM2000 |
Yes. This part is quoted at 2 layers and the plant fabricates 1 to 64 layers, including sequential-lamination HDI up to 5+N(N+M)+5.
It can. Glass is what this part is built on, but material is a design input — Rogers, Arlon, Taconic, Isola, Nelco, Panasonic, TUC, ITEQ, SYTech, Ventec and KB grades are all stocked, and customer-supplied stock is accepted.
No. No is specified here; ENIG at 1–3 μin gold, ENEPIG, hard gold to 3.0 μm, immersion silver, immersion tin, OSP and lead-free HASL are alternatives, subject to panel size limits on HASL.
Gerber RS-274X plus a drill file and a stack-up or impedance note. PowerPCB, CAD, AutoCAD, OrCAD, P-CAD, CAM-350 and CAM2000 formats are also accepted. Quotation normally comes back within 6 hours.
Send the part number or your own Gerber set. An engineer replies with price, lead time and any DFM comments — usually inside 6 hours.
