Multilayer PCB
This 12-layer HDI PCB & Buried Capacitance is pressed on FR4 IT180A and finished at 2.4 mm overall thickness with ENIG 1u over green solder mask and white legend. What makes this part non-trivial: Buried Capacitance processing, copper geometry held to 3.0 mil line width and 3.0 mil spacing, mechanical holes from 0.15 mm. Quality release covers 100% AOI, ICT and FCT testing, IPC-A-610 E Class II and thickness to ±10%. This one was quoted for electronic device.
Quotation within 6 hours. Gerber, PowerPCB, CAD, AutoCAD, OrCAD, P-CAD, CAM-350 and CAM2000 files accepted.
Buried Capacitance runs on our own lines alongside POFV, backdrill, edge plating, plated half holes and step gold finger — no second supplier.
This part is 12-layer; the same presses run 1 to 64 layers, so a stack-up revision does not force a supplier change.
Built on FR4 IT180A — FR4 — drawn from over 120 laminate types held in the warehouse, from KB and ITEQ through Rogers, Isola and Panasonic.
Etched to 3.0 mil width and 3.0 mil spacing here; the process floor is 2/2 mil inner at 1/3 oz copper, with ±10% accuracy on impedance layers.
Finished with ENIG 1u. ENIG 1–3 μin, ENEPIG, hard gold to 3.0 μm, immersion silver, immersion tin, OSP and lead-free HASL are all in-house.
These are the parameters this part was quoted, tooled and shipped against.
| Parameter | Value |
|---|---|
| PCB Type | HDI PCB & Buried Capacitance |
| Number of Layers | 12 Layers (Max 64 Layers) |
| Finished Thickness | 2.4 mm (Max 8mm) |
| Base Material | FR4 IT180A |
| Copper Thickness | 1oz |
| Min. Mechanical Hole | 0.15 mm (Min 0.1mm) |
| Min. Line Width | 3.0 mil (Min 2mil) |
| Min. Line Spacing | 3.0 mil (Min 2mil) |
| Surface Finishing | ENIG 1u |
| Solder Mask | Green |
| Silk Screen | White |
| Thickness Tolerance | ±10% |
| Impedance Control Accuracy | ±10% (min±5%) |
| Testing Service | 100% AOI ICT FCT Testing |
| Special Processes | Buried Capacitance |
| PCB Standard | IPC-A-610 E Class II |
| Brand Name | PEAK PCB |
| Place of Origin | Shenzhen, Guangdong, China |
| Packaging Inner | Vacuum Packing/ Anti-Static Package |
| Packaging Outer | Export Carton/ Customizable |
| Port | Shenzhen,Hongkong |
| Supply Ability | Sample and Mass Production |
| Finished Inner Copper Thickness | Hoz (Max 14oz) |
| Finished Outer Copper Thickness | 1oz (Max 14oz) |
| Outline Profile | Rout/ V-cut/ Bridge/ Stamp Hole |
| Application | Electronic Device |
| Acceptable File Format | Gerber file, Powerpcb, CAD, AUTOCAD, ORCAD, P-CAD, CAM-350, CAM2000 |
Yes. This part is quoted at 12 layers and the plant fabricates 1 to 64 layers, including sequential-lamination HDI up to 5+N(N+M)+5.
It can. FR4 IT180A is what this part is built on, but material is a design input — Rogers, Arlon, Taconic, Isola, Nelco, Panasonic, TUC, ITEQ, SYTech, Ventec and KB grades are all stocked, and customer-supplied stock is accepted.
No. ENIG 1u is specified here; ENIG at 1–3 μin gold, ENEPIG, hard gold to 3.0 μm, immersion silver, immersion tin, OSP and lead-free HASL are alternatives, subject to panel size limits on HASL.
Gerber RS-274X plus a drill file and a stack-up or impedance note. PowerPCB, CAD, AutoCAD, OrCAD, P-CAD, CAM-350 and CAM2000 formats are also accepted. Quotation normally comes back within 6 hours.
Send the part number or your own Gerber set. An engineer replies with price, lead time and any DFM comments — usually inside 6 hours.
