Multilayer PCB
4 layers ENIG 1u Conductive Via Fill is a 4-layer construction on FR4 TG135, delivered at 1.2 mm with ENIG 1u over green solder mask and white legend. Manufacturing tolerance is driven by copper geometry held to 3.6 mil line width and 3.6 mil spacing, mechanical holes from 0.3 mm, finished copper at ½ oz / 1 oz. Inspection runs 100% AOI, ICT and FCT testing, judged to IPC-A-610 E Class II with thickness to ±10%. The part ships into electronics device applications.
Quotation within 6 hours. Gerber, PowerPCB, CAD, AutoCAD, OrCAD, P-CAD, CAM-350 and CAM2000 files accepted.
This part is 4-layer; the same presses run 1 to 64 layers, so a stack-up revision does not force a supplier change.
Built on FR4 TG135 — FR4 — drawn from over 120 laminate types held in the warehouse, from KB and ITEQ through Rogers, Isola and Panasonic.
Etched to 3.6 mil width and 3.6 mil spacing here; the process floor is 2/2 mil inner at 1/3 oz copper, with ±10% accuracy on impedance layers.
Finished with ENIG 1u. ENIG 1–3 μin, ENEPIG, hard gold to 3.0 μm, immersion silver, immersion tin, OSP and lead-free HASL are all in-house.
Drilling covers 0.15 mm mechanical and 0.076 mm laser holes, backdrill to ±0.1 mm and depth control to 0.05 mm.
These are the parameters this part was quoted, tooled and shipped against.
| Parameter | Value |
|---|---|
| PCB Type | Regular Multilayer PCB |
| Number of Layers | 4 Layers (Max 64 Layers) |
| Finished Thickness | 1.2 mm (Max 8mm) |
| Base Material | FR4 TG135 |
| Copper Thickness | 1oz |
| Min. Mechanical Hole | 0.3mm (Min 0.1mm) |
| Min. Line Width | 3.6 mil (Min 2mil) |
| Min. Line Spacing | 3.6 mil (Min 2mil) |
| Surface Finishing | ENIG 1u |
| Solder Mask | Green |
| Silk Screen | White |
| Thickness Tolerance | ±10% |
| Impedance Control Accuracy | ±10% (min±5%) |
| Testing Service | 100% AOI ICT FCT Testing |
| Special Processes | No |
| PCB Standard | IPC-A-610 E Class II |
| Brand Name | PEAK PCB |
| Place of Origin | Shenzhen, Guangdong, China |
| Packaging Inner | Vacuum Packing/ Anti-Static Package |
| Packaging Outer | Export Carton/ Customizable |
| Port | Shenzhen,Hongkong |
| Supply Ability | Sample and Mass Production |
| Finished Inner Copper Thickness | Hoz (Max 14oz) |
| Finished Outer Copper Thickness | 1oz (Max 14oz) |
| Outline Profile | Rout/ V-cut/ Bridge/ Stamp Hole |
| Application | Electronics Device |
| Acceptable File Format | Gerber file, Powerpcb, CAD, AUTOCAD, ORCAD, P-CAD, CAM-350, CAM2000 |
Yes. This part is quoted at 4 layers and the plant fabricates 1 to 64 layers, including sequential-lamination HDI up to 5+N(N+M)+5.
It can. FR4 TG135 is what this part is built on, but material is a design input — Rogers, Arlon, Taconic, Isola, Nelco, Panasonic, TUC, ITEQ, SYTech, Ventec and KB grades are all stocked, and customer-supplied stock is accepted.
No. ENIG 1u is specified here; ENIG at 1–3 μin gold, ENEPIG, hard gold to 3.0 μm, immersion silver, immersion tin, OSP and lead-free HASL are alternatives, subject to panel size limits on HASL.
Gerber RS-274X plus a drill file and a stack-up or impedance note. PowerPCB, CAD, AutoCAD, OrCAD, P-CAD, CAM-350 and CAM2000 formats are also accepted. Quotation normally comes back within 6 hours.
Send the part number or your own Gerber set. An engineer replies with price, lead time and any DFM comments — usually inside 6 hours.
