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Palm fiber plating line inside the PEAK PCB fabrication plant in Shenzhen
Placement head mounting components on green printed circuit boards during SMT assembly
Exterior of the PEAK printed circuit board manufacturing plant in Bao'an District, Shenzhen

Rigid, rigid-flex, HDI and substrate — one plant

All rigid and rigid-flex PCB services under one roof

1 to 64 layers fabricated, assembled, tested and validated in a 54,000 m² Shenzhen plant — so a stack-up change does not mean changing suppliers.

Get a quote in 6 hours See fabrication capability

Expedited samples in as little as 8 hours

Quick-turn fabrication plus turnkey PCBA

Bare board, stencil, SMT, DIP, ICT and FCT testing from one purchase order, under GJB9001C military, IATF 16949 and ISO 13485 certified systems.

Start a turnkey build PCB assembly services

Down to 2 mil trace, 0.075 mm laser via

The boards other shops quote as not manufacturable

HDI up to 5+N(N+M)+5, hybrid lamination, buried capacitance, POFV, backdrill and step gold finger — released for mass production, not just prototypes.

Send your Gerber files Browse special processes
  • 1–64Layer count fabricated in-house
  • 54,000 m²Plant area across two production bases
  • 190+Countries shipped to
  • 18,500+Businesses and innovators served

Why engineers move a programme here

One plant, from DFM review to a tested assembly

PEAK was founded in Shenzhen in 2007 and now fabricates 1–64 layer rigid, rigid-flex, HDI, high-frequency, high-speed, metal-core and IC-substrate boards, then assembles and tests them in the same facility.

Who we build for

OEM engineering teams in aerospace and defense, medical, semiconductor test, telecom infrastructure, automotive and industrial control — the projects where a board is qualified once and then has to be reproducible for years.

What we solve

Designs that fail DFM at ordinary shops: 18-layer stacks, Rogers-plus-FR4 hybrid lamination, 2 mil trace and space, 0.075 mm laser vias, 14 oz copper, CTI ≥ 600 and plated half holes on the same panel.

How we do it

Fabrication, stencil, assembly and electrical test sit in the same 54,000 m² plant, so impedance coupons, slice analysis and flying-probe results come back to one engineering team instead of crossing three vendors.

Why it is credible

GJB9001C military certification, IATF 16949, ISO 13485, ISO 9001, ISO 14001, UL and CQC approvals; 11 granted production patents; 45+ engineers; shipments to 190+ countries since 2007.

Construction types

Eight process windows, published as numbers

These are the capability limits the plant actually runs to. Pick the closest one and the detail page lists the material sets and the boards already built against it.

Aluminium, copper and iron base

Metal Core PCB

  • Thermal conductivity 1–398 W/m·K
  • Aluminium / copper AC 500–4000 V
  • Post-bonding and pre-bonding
  • Sweat soldering and conductive adhesive
Process window →
Blind, buried and hybrid via structures

HDI PCB

  • Blind / buried / hybrid via
  • 5+N(N+M)+5 structure
  • Trace width and spacing 1.6 / 1.6 mil
  • Laser hole size ≥ 0.075 mm
Process window →
2–24 layers, book and air-gap

Rigid-Flex PCB

  • 2–24 layers
  • Book / air-gap / fly-tail
  • Unsymmetrical and semi-flex
  • Width of flexible zone 3 mm (min)
Process window →
85+ RF laminate types

High Frequency PCB

  • More than 85+ laminate types
  • Rogers / Arlon / Taconic / Isola / Nelco / F4B series
  • Materials can be specified by the customer
  • Impedance tolerance ±5% (min)
Process window →
Megtron, TU-872SLK, FR408HR

High Speed PCB

  • Panasonic Megtron 4 / 6 / 7
  • TU-872SLK / Isola FR408HR and similar
  • Impedance tolerance ±5% (min)
  • Dimension accuracy ±0.02 mm (min)
Process window →

Built and shipped

Boards taken from live production

Every listing carries the stack-up, material, geometry and finish it was manufactured to — 150 of them, across 47 categories.

See all 150 boards

Proof, not adjectives

Certified for defense, automotive and medical work

45+Engineers on staff
11Granted PCB production patents
8 hExpedited sample fabrication (1–2 layer)
120+Laminate types held in the warehouse
GJB9001C Military Certification certificate held by PEAK Technology
GJB9001C Military Certification
ISO 9001:2015 certificate held by PEAK Technology
ISO 9001:2015
IATF 16949:2016 certificate held by PEAK Technology
IATF 16949:2016
ISO 13485:2016 certificate held by PEAK Technology
ISO 13485:2016
ISO 14001:2015 certificate held by PEAK Technology
ISO 14001:2015

All certifications, test reports and patents

How a job runs

From Gerber to a tested board

  1. Design for manufacture reviewGerber, stack-up and impedance targets are checked against the process window before tooling — 45+ engineers, quotation inside 6 hours.
  2. Material selection and cuttingLaminate is drawn from 120+ stocked types; Tg, Dk/Df, CTI and base metal are matched to the specified performance.
  3. Inner layer imaging and etchingLDI exposure with ≤ 24 μm alignment accuracy; inner line width and space down to 2/2 mil at 1/3 oz copper.
  4. LaminationAutomatic laminator and press board furnace build 4–48 layer mixed stacks, including FR4 with RF, metal base or FPC.
  5. Drilling and laser via formationMechanical holes from 0.15 mm, laser holes from 0.076 mm, backdrill to ±0.1 mm depth.
  6. Plating and surface finishCopper sinking, graphic plating, then ENIG, ENEPIG, immersion silver or tin, OSP, hard gold or lead-free HASL.
Full capability tables
Plating line inside the PEAK PCB fabrication plant

Quotation in 6 hours

45+ engineers review DFM, stack-up and impedance targets before tooling starts.

Samples in 8 hours

Expedited 1–2 layer samples; multilayer and HDI samples on a quoted schedule.

Industries

Where these boards end up

Industrial Controls

Controllers, drives and motherboards that have to survive a factory floor for a decade and stay buildable from the same data package.

Optical Modules

Transceiver boards where insertion loss budget and mechanical registration are decided by the laminate and the etch, not by the layout.

mmWave Radar

Automotive and industrial radar front ends built on specified PTFE and ceramic-filled laminates, with blind vias placed to keep the feed network clean.

IC Substrate and Packaging

Substrate-like carriers for CSP, FC-BGA and SiP packages, where the tolerance stack is measured in microns across the whole array.

5G Base Stations

Infrastructure boards that combine an RF section, a high-speed digital section and a power section on one panel — usually as a hybrid stack.

Memory and Storage

Memory sticks, USB drives and storage carriers where gold finger construction and outline accuracy decide the insertion life of the part.

Knowledge base

Engineering reference

All 12 articles

Send the Gerber files, get a real answer

Quotation inside 6 hours, DFM feedback with it. No forms — email or WhatsApp reaches the engineering team directly.

Email a quotation request WhatsApp the engineering team