SUB PCB
SYTech Sl10U Double-Side 0.25mm Thickness ENEPIG IC Substrate PCB Board is a 2-layer construction on SYTech Sl10U, delivered at 0.25 mm with ENEPIG over black solder mask. Manufacturing tolerance is driven by copper geometry held to 75 μm line width and 105 μm spacing, mechanical holes from 105 μm, finished copper at ½ oz / ½ oz. Acceptance is 100% AOI, ICT and FCT testing against IPC-A-610 E Class III, with thickness to ±5% and outline by Rout / V-cut / Bridge / Stamp Hole. The part ships into USB flash drives and storage devices applications.
Quotation within 6 hours. Gerber, PowerPCB, CAD, AutoCAD, OrCAD, P-CAD, CAM-350 and CAM2000 files accepted.
This part is 2-layer; the same presses run 1 to 64 layers, so a stack-up revision does not force a supplier change.
Built on SYTech Sl10U — engineered laminate — drawn from over 120 laminate types held in the warehouse, from KB and ITEQ through Rogers, Isola and Panasonic.
Etched to 75 μm width and 105 μm spacing here; the process floor is 2/2 mil inner at 1/3 oz copper, with ±10% accuracy on impedance layers.
Finished with ENEPIG. ENIG 1–3 μin, ENEPIG, hard gold to 3.0 μm, immersion silver, immersion tin, OSP and lead-free HASL are all in-house.
Drilling covers 0.15 mm mechanical and 0.076 mm laser holes, backdrill to ±0.1 mm and depth control to 0.05 mm.
These are the parameters this part was quoted, tooled and shipped against.
| Parameter | Value |
|---|---|
| PCB Type | Substrate PCB |
| Number of Layers | 2 Layers (Max 64 Layers) |
| Finished Thickness | 0.25 mm (Max 8mm) |
| Base Material | SYTech Sl10U |
| Copper Thickness | Hoz |
| Min. Hole | 105um |
| Min. Line Width | 75um |
| Min. Line Spacing | 105um |
| Surface Finishing | ENEPIG |
| Solder Mask | Black |
| Silk Screen | No |
| Thickness Tolerance | ±5% |
| Impedance Control Accuracy | ±10% (min±5%) |
| Testing Service | 100% AOI ICT FCT Testing |
| Special Processes | No |
| PCB Standard | IPC-A-610 E Class III |
| Brand Name | PEAK PCB |
| Place of Origin | Shenzhen, Guangdong, China |
| Packaging Inner | Vacuum Packing/ Anti-Static Package |
| Packaging Outer | Export Carton/ Customizable |
| Port | Shenzhen,Hongkong |
| Supply Ability | Sample and Mass Production |
| Finished Inner Copper Thickness | 0oz (Max 14oz) |
| Finished Outer Copper Thickness | Hoz (Max 14oz) |
| Outline Profile | Rout/ V-cut/ Bridge/ Stamp Hole |
| Application | USB Flash Drives and Storage Devices |
| Acceptable File Format | Gerber file, Powerpcb, CAD, AUTOCAD, ORCAD, P-CAD, CAM-350, CAM2000 |
Yes. This part is quoted at 2 layers and the plant fabricates 1 to 64 layers, including sequential-lamination HDI up to 5+N(N+M)+5.
It can. SYTech Sl10U is what this part is built on, but material is a design input — Rogers, Arlon, Taconic, Isola, Nelco, Panasonic, TUC, ITEQ, SYTech, Ventec and KB grades are all stocked, and customer-supplied stock is accepted.
No. ENEPIG is specified here; ENIG at 1–3 μin gold, ENEPIG, hard gold to 3.0 μm, immersion silver, immersion tin, OSP and lead-free HASL are alternatives, subject to panel size limits on HASL.
Gerber RS-274X plus a drill file and a stack-up or impedance note. PowerPCB, CAD, AutoCAD, OrCAD, P-CAD, CAM-350 and CAM2000 formats are also accepted. Quotation normally comes back within 6 hours.
Send the part number or your own Gerber set. An engineer replies with price, lead time and any DFM comments — usually inside 6 hours.
