SUB PCB
Built as a 4-layer stack on HL832N, this board leaves the line at 0.25 mm thickness under ENEPIG over green solder mask. The demanding part of this build is copper geometry held to 25 μm line width and 25 μm spacing, mechanical holes from 75 μm, finished copper at ½ oz / ½ oz. Every panel is released on 100% AOI, ICT and FCT testing to IPC-A-610 E Class III, holding outline by Rout / V-cut / Bridge / Stamp Hole. Typical end use is USB flash drives and storage devices.
Quotation within 6 hours. Gerber, PowerPCB, CAD, AutoCAD, OrCAD, P-CAD, CAM-350 and CAM2000 files accepted.
This part is 4-layer; the same presses run 1 to 64 layers, so a stack-up revision does not force a supplier change.
Built on HL832N — engineered laminate — drawn from over 120 laminate types held in the warehouse, from KB and ITEQ through Rogers, Isola and Panasonic.
Etched to 25 μm width and 25 μm spacing here; the process floor is 2/2 mil inner at 1/3 oz copper, with ±10% accuracy on impedance layers.
Finished with ENEPIG. ENIG 1–3 μin, ENEPIG, hard gold to 3.0 μm, immersion silver, immersion tin, OSP and lead-free HASL are all in-house.
Drilling covers 0.15 mm mechanical and 0.076 mm laser holes, backdrill to ±0.1 mm and depth control to 0.05 mm.
These are the parameters this part was quoted, tooled and shipped against.
| Parameter | Value |
|---|---|
| PCB Type | Substrate PCB |
| Number of Layers | 4 Layers (Max 64 Layers) |
| Finished Thickness | 0.25 mm (Max 8mm) |
| Base Material | HL832N |
| Copper Thickness | Hoz |
| Min. Hole | 75um |
| Min. Line Width | 25um |
| Min. Line Spacing | 25um |
| Surface Finishing | ENEPIG |
| Solder Mask | Green |
| Silk Screen | No |
| Thickness Tolerance | ±5% |
| Impedance Control Accuracy | ±10% (min±5%) |
| Testing Service | 100% AOI ICT FCT Testing |
| Special Processes | No |
| PCB Standard | IPC-A-610 E Class III |
| Brand Name | PEAK PCB |
| Place of Origin | Shenzhen, Guangdong, China |
| Packaging Inner | Vacuum Packing/ Anti-Static Package |
| Packaging Outer | Export Carton/ Customizable |
| Port | Shenzhen,Hongkong |
| Supply Ability | Sample and Mass Production |
| Finished Inner Copper Thickness | Hoz (Max 14oz) |
| Finished Outer Copper Thickness | Hoz (Max 14oz) |
| Outline Profile | Rout/ V-cut/ Bridge/ Stamp Hole |
| Application | USB Flash Drives and Storage Devices |
| Acceptable File Format | Gerber file, Powerpcb, CAD, AUTOCAD, ORCAD, P-CAD, CAM-350, CAM2000 |
Yes. This part is quoted at 4 layers and the plant fabricates 1 to 64 layers, including sequential-lamination HDI up to 5+N(N+M)+5.
It can. HL832N is what this part is built on, but material is a design input — Rogers, Arlon, Taconic, Isola, Nelco, Panasonic, TUC, ITEQ, SYTech, Ventec and KB grades are all stocked, and customer-supplied stock is accepted.
No. ENEPIG is specified here; ENIG at 1–3 μin gold, ENEPIG, hard gold to 3.0 μm, immersion silver, immersion tin, OSP and lead-free HASL are alternatives, subject to panel size limits on HASL.
Gerber RS-274X plus a drill file and a stack-up or impedance note. PowerPCB, CAD, AutoCAD, OrCAD, P-CAD, CAM-350 and CAM2000 formats are also accepted. Quotation normally comes back within 6 hours.
Send the part number or your own Gerber set. An engineer replies with price, lead time and any DFM comments — usually inside 6 hours.
