Polyamide Hot Melt Adhesive Resin UA-G0175
High viscosity polyamide resin for low pressure moulding and filter bonding
| Model | UA-G0175 |
|---|---|
| Material Base | Polyamide (PA) |
| Melting Range | 158-173 C |
| Viscosity | 18000 mPa.s |
What This Grade Is Built For
UA-G0175 is a polyamide hot melt adhesive resin with a melting range of 158-173 C and a viscosity of 18000 mPa.s. The high viscosity is the point: it holds its shape as a bead or a fillet instead of wicking into media, which is what filter end cap bonding needs, and it gives a thicker wall in low pressure moulding.
Key Benefits
- High viscosity holds a bead where it is placed instead of wicking into filter media
- Melting range 158-173 C suits both low pressure moulding and filter end cap bonding
- Polyamide chemistry keeps strength at elevated service temperature
- One resin covers two processes, which reduces the number of grades on the shop floor
- Solvent free and re-meltable
Buyers Who Specify This Grade
- Filter element manufacturers bonding media to end caps
- Low pressure moulding houses needing a higher viscosity grade than UA-G182C
- Assemblies that need a structural fillet rather than a thin encapsulation
What It Fixes On The Line
- Low viscosity adhesives disappear into filter media and starve the joint
- Reactive polyurethane needs cure time and moisture control on the line
- Thin encapsulation walls crack under vibration; a higher viscosity grade builds thickness
Application Scenarios
- Low pressure moulding of electronic assemblies
- Air and oil filter end cap bonding
- Pleat pack sealing in filter elements
- Sealing and encapsulation where a thicker adhesive wall is wanted
How It Behaves In Process
- Melting range 158-173 C
- Viscosity 18000 mPa.s
- Polyamide base
- Suitable for low pressure moulding (LPM) and filter applications
What It Is Made Of
Polyamide resin based on renewable raw materials such as castor or rape seed oil.
Customisation
- Where 18000 mPa.s is too high for the applicator, UA-G182C at 5000-7000 mPa.s covers the lower viscosity end of the same chemistry.
Published Data For Polyamide Hot Melt Adhesive Resin UA-G0175
Only values published for this grade are listed. Where a value is grade specific rather than fixed, the data sheet issued with your quotation carries it.
| Model | UA-G0175 |
|---|---|
| Material Base | Polyamide (PA) |
| Melting Range | 158-173 C |
| Viscosity | 18000 mPa.s |
| Form | Granule |
| Primary Process | Low pressure moulding, filter bonding |
How This Grade Is Applied
Step 01
Melt in the tank or hot melt applicator
Step 02
Apply as a bead to the end cap or inject into the low pressure mould
Step 03
Set the media or close the mould while the adhesive is open
Step 04
Cool to set — no cure time and no pot life
Quality Control
Melting range and viscosity are checked per batch; the batch values can be supplied with the shipment on request.
Use Guide
- Check the applicator can handle 18000 mPa.s before specifying this grade
- Keep the melt at the working temperature rather than cycling it, to limit thermal history
- Bond while the adhesive is still open; polyamide sets quickly on cooling
- Store sealed and dry
How It Compares With The Alternatives
| Compared with | What changes |
|---|---|
| UA-G182C black polyamide | UA-G182C is far lower in viscosity and black. Use it for thin wall encapsulation; use UA-G0175 where the bead must stand up. |
| Polyamide hot melt powder | Powder is for scatter coating and lamination over an area. This resin is for a placed bead or a moulded shot. |
| Reactive polyurethane filter adhesive | Reactive PU needs cure and moisture management; this polyamide sets on cooling and is re-meltable. |
Application Notes Featuring This Grade
Bonding Filter Media To End Caps With High Viscosity Polyamide Resin
Filter adhesives fail in a specific way: the adhesive wicks into the pleats and leaves the joint starved. A viscosity of 18000 mPa.s is the answer to that.
Application NoteEncapsulating A Tyre Pressure Monitoring Sensor With Black Polyamide Resin
A TPMS module has to survive wheel-well temperature swings, road salt and constant vibration, with a battery and a radio on the same small board. Low pressure moulding with black polyamide resin seals all of it in one shot.
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View Grade DataGuides That Explain This Grade
Low Pressure Molding Of Electronics A Practical Process Guide
Low pressure molding encapsulates fragile components in 8 to 50 seconds with no chemical reaction. Here is what the process does, what it needs and where it fits against potting.
Material GuideWhat Is A Thermoplastic Hot Melt Adhesive And When To Use One
Hot melts bond by cooling, not by curing. That single difference explains most of what they are good at and most of what they are not.
Polyamide Hot Melt Adhesive Resin UA-G0175 FAQ
Why is the viscosity so high
Because the joints it is made for — filter end caps and thick wall moulding — fail when the adhesive runs. 18000 mPa.s keeps the bead in place.
Can it bond filter media to metal end caps
Polyamide hot melts are used for filter applications. The media, the end cap material and the service temperature decide the grade, so send those three details by email.
Is a lower viscosity version available
Yes — UA-G182C is a 5000-7000 mPa.s polyamide in the same family.
What service temperature can polyamide hold
Special polyamide hot melts are capable of passing the -45 C to +135 C temperature tests required in the electrical and electronic sector for the automobile industry. Confirm the rating for a specific grade with us.
Do you supply a data sheet
Yes, on request by email.
Request Data Or A Sample Of Polyamide Hot Melt Adhesive Resin UA-G0175
Data sheets are grade specific and issued by email. Tell us the substrates and your process temperature limit and the right sheet comes back with the quotation.