Black Polyamide Hot Melt Resin UA-G182C
Black polyamide resin for low pressure moulding of automotive and electronic assemblies
| Model | UA-G182C |
|---|---|
| Material Base | Polyamide (PA) |
| Colour | Black |
| Melting Point | 165-182 C |
What This Grade Is Built For
UA-G182C is a black polyamide hot melt resin designed specifically for the low pressure injection moulding process. It melts at 165-182 C and is processed at around 210 C, where its viscosity sits between 5000 and 7000 mPa.s — low enough to flow around a populated board at a few bar, high enough not to run out of the cavity before it sets. It is used to encapsulate and seal assemblies in the automotive, electrical and electronic industries.
Key Benefits
- Encapsulates populated PCBs at low pressure, so tracks, wire bonds and fine pitch connectors are not crushed
- No chemical reaction during moulding — nothing cures, nothing exotherms, nothing shrinks onto the part
- Black colour hides the board and gives a finished appearance without a secondary housing
- Seals against moisture, dust and vibration in one shot, replacing a housing plus a potting step
- Re-meltable thermoplastic, so rework and material recovery stay possible
Buyers Who Specify This Grade
- Automotive electronics suppliers moulding sensor and control modules
- Contract electronics manufacturers replacing potting with low pressure moulding
- Connector and cable assembly makers sealing plugs and strain reliefs
- Moulding houses that already run Amber polyamide and need a black option
What It Fixes On The Line
- Two-part potting resins cure slowly and tie up fixtures — low pressure moulding releases in 8 to 50 seconds
- High pressure overmoulding damages fragile components; this grade works at low pressure
- Transparent or amber encapsulation shows the board; black gives a finished part
- Solvent and reactive systems raise VOC and handling questions in an audit
Application Scenarios
- Tyre pressure monitoring systems (TPMS)
- PCBs for seat occupant sensors
- Belt lock sensors
- ECUs for motorcycles
- Air quality sensors
- Antennas for RF devices
- Smart entry (E-Key) systems
How It Behaves In Process
- Melting point 165-182 C
- Viscosity 5000-7000 mPa.s measured at 210 C
- Black opaque finish
- Formulated for low pressure injection moulding (LPIM / LPM)
- Thermoplastic — no cure step, no pot life
What It Is Made Of
Polyamide resin. United Industry polyamide hot melts are made from renewable raw materials such as castor or rape seed oil.
Customisation
- Colour and viscosity variants are available; amber polyamide resin covers the same process where a lighter encapsulation is acceptable.
Published Data For Black Polyamide Hot Melt Resin UA-G182C
Only values published for this grade are listed. Where a value is grade specific rather than fixed, the data sheet issued with your quotation carries it.
| Model | UA-G182C |
|---|---|
| Material Base | Polyamide (PA) |
| Colour | Black |
| Melting Point | 165-182 C |
| Viscosity | 5000-7000 mPa.s at 210 C |
| Form | Granule |
| Primary Process | Low pressure injection moulding |
How This Grade Is Applied
Step 01
Melt the granule in the low pressure moulding tank
Step 02
Inject into the mould at low pressure over the component
Step 03
Cool in the closed mould
Step 04
Demould the encapsulated part — cycle time typically 8 to 50 seconds
Quality Control
Melting point and viscosity are the two control values for this grade and are checked per batch. Ask for the batch data with your order.
Use Guide
- Dry storage in the sealed bag until use; polyamide picks up moisture from humid air
- Set tank temperature around 210 C where the published viscosity applies
- Keep mould pressure low — the point of the process is that the component is not loaded
- Purge the tank before a colour change; black pigment carries over
How It Compares With The Alternatives
| Compared with | What changes |
|---|---|
| Amber polyamide resin | Same process and the same fatty acid chemistry. Choose amber when the encapsulation may be translucent, black when the assembly should be hidden. |
| Polyolefin resin | Polyolefin bonds better to PP, PE and PET and stays softer. Polyamide is the stronger choice on PA 6.6, ABS and PVC housings. |
| Two-part epoxy potting | Epoxy cures chemically and shrinks; polyamide LPM is thermoplastic, sets on cooling and releases the part in under a minute. |
Application Notes Featuring This Grade
Encapsulating A Tyre Pressure Monitoring Sensor With Black Polyamide Resin
A TPMS module has to survive wheel-well temperature swings, road salt and constant vibration, with a battery and a radio on the same small board. Low pressure moulding with black polyamide resin seals all of it in one shot.
Application NoteSealing A Connector And Moulding Strain Relief In One Operation
Hot melts are used for sealing the plug and also for cable strain relief. Doing both in one low pressure shot removes a whole assembly step.
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Low Pressure Molding Of Electronics A Practical Process Guide
Low pressure molding encapsulates fragile components in 8 to 50 seconds with no chemical reaction. Here is what the process does, what it needs and where it fits against potting.
Comparison GuidePolyamide Versus TPU Versus Copolyester For Heat Applied Adhesives
Three polymers, three different questions. Strength, stretch or wash — pick the one that decides your failure mode and the rest follows.
Black Polyamide Hot Melt Resin UA-G182C FAQ
What moulding pressure does UA-G182C need
Low pressure moulding runs at a fraction of standard injection moulding pressure, which is why populated boards survive it. Exact settings depend on your machine and cavity; send the part geometry by email and we will comment on the grade.
How long is one moulding cycle
Low pressure moulding cycles typically run 8 to 50 seconds depending on shot weight and cooling.
Is it the same material as Amber Polyamide Resin
The performance is the same. Black and amber exist so that the finished encapsulation can be hidden or left translucent.
Can it be reworked
Yes. It is a thermoplastic hot melt, so it can be remelted and removed, unlike a cured two-part potting compound.
Can you send a technical data sheet
Yes — email us with the application and we will send the current data sheet for UA-G182C.
Request Data Or A Sample Of Black Polyamide Hot Melt Resin UA-G182C
Data sheets are grade specific and issued by email. Tell us the substrates and your process temperature limit and the right sheet comes back with the quotation.