
Hot Melt Adhesive Knowledge Centre
Selection and process guides written around the grades we actually supply. Every number quoted comes from a published grade specification rather than a general reference.
Material And Process Guides
What Is A Thermoplastic Hot Melt Adhesive And When To Use One
Hot melts bond by cooling, not by curing. That single difference explains most of what they are good at and most of what they are not.
Comparison GuidePolyamide Versus TPU Versus Copolyester For Heat Applied Adhesives
Three polymers, three different questions. Strength, stretch or wash — pick the one that decides your failure mode and the rest follows.
Process GuideTime Temperature And Pressure In Heat Transfer Printing
Three key components decide every heat press result. Every heat transfer material has its own instructions for all three, and most failures are one of them being wrong.
Process GuideLow Pressure Molding Of Electronics A Practical Process Guide
Low pressure molding encapsulates fragile components in 8 to 50 seconds with no chemical reaction. Here is what the process does, what it needs and where it fits against potting.
Buying GuideHow To Choose Hot Melt Powder Particle Size
Particle size decides whether powder passes your mesh cleanly and how much adhesive ends up on the substrate. Pick the fraction before you pick anything else.
Buying GuideChoosing Hot Melt Adhesive Film Thickness And Width
With film, the coat weight is a specification rather than a process variable. Thickness, width and processing temperature are the three numbers to get right.
Worked Examples From Production
This is an application reference built from the published process data for the grades named on this page. It describes a typical setup rather than a specific customer project, so treat the parameters as a starting point for your own trial.
Encapsulating A Tyre Pressure Monitoring Sensor With Black Polyamide Resin
A TPMS module has to survive wheel-well temperature swings, road salt and constant vibration, with a battery and a radio on the same small board. Low pressure moulding with black polyamide resin seals all of it in one shot.
Application NoteSealing A Connector And Moulding Strain Relief In One Operation
Hot melts are used for sealing the plug and also for cable strain relief. Doing both in one low pressure shot removes a whole assembly step.
Application NoteBonding Filter Media To End Caps With High Viscosity Polyamide Resin
Filter adhesives fail in a specific way: the adhesive wicks into the pleats and leaves the joint starved. A viscosity of 18000 mPa.s is the answer to that.
Application NoteChoosing Between Polyamide And Copolyester For Heel Counter Bonding
The counter is what keeps the heel in shape. Whether polyamide or copolyester is the right adhesive is decided by the upper material, not by the counter.
Application NoteKeeping A Transfer Intact On A High Stretch Garment
A transfer that passes the peel test on the press table and cracks on the body is not a bond strength problem. It is an elongation problem.
Application NoteMatching Transfer Powder Fraction To Screen Mesh
Most transfer powder complaints are not about the polymer. They are about a particle fraction that does not suit the mesh already on the line.
About The Knowledge Centre
What is in the knowledge centre
6 technical guides covering material selection, powder particle size, film thickness, heat press parameters and the low pressure moulding process, plus 6 application notes.
Are the guides specific to your products
They use our published grade data as the worked examples, but the process logic applies to thermoplastic hot melts generally.
Where should I start
If you are choosing a polymer, start with the polyamide versus TPU versus copolyester comparison. If you already know the polymer, go to the particle size or film thickness guide.
Can I get these as PDF documents
Technical data sheets are issued per grade by email. The guides themselves stay on the site so they can be kept current.
Cannot Find The Answer In A Guide
Technical questions are answered by email during Chinese working hours. Include the substrates and the temperature limits and the reply will be specific.
