High Layer Count Boards For Processor Based Designs
Computing boards combine high layer counts, controlled impedance and a lot of mechanical parts. The electrical design gets the attention, but the things that actually delay a launch are usually socket coplanarity, chassis fit and connector alignment.
What Actually Fails In Computing And Embedded
Four failure modes specific to this sector, and the published figure that each one is controlled by.
Bus speed
Memory and expansion buses need reference planes and a stack-up designed for them, not adjusted after the first article fails.
Socket seating
Processor sockets need a flat board. Warpage is held at 0.75% or better across the panel.
Chassis apertures
Rear port clusters have no tolerance to give. Outline is held to ±0.10 mm and hole position to ±0.05 mm.
Fine pitch yield
Minimum solder bridge of 0.10 mm keeps mask between fine pitch pads reliable.
Boards We Build For This Sector
Computing boards run at ten to sixteen layers with immersion gold, assembled in house so that socket and slot placement is inspected as mechanical work rather than as solder joints.
Assembled Motherboard With Expansion Slot And Rear Port Cluster
Ten Layer Immersion Gold Board For High Density Digital Designs
Twelve Layer Immersion Gold Board With Edge Connector Fingers
Assembled Multi Port Board With USB Card Slot And Shielded Modules
Four Layer Immersion Gold Board For Dense SMD Routing
Four Ways To Buy For A Computing And Embedded Programme
Prototyping, design support, turnkey assembly and one stop supply across all three substrate families.
Fast Turn Prototyping
Get The First Boards Back Before The Design Goes Cold
SolutionPCB Design Support
Design Review Against Real Process Limits
SolutionTurnkey PCBA Assembly
Bare Board And Assembly Quoted As One Finished Unit
SolutionOne Stop Supply
One Supplier For Rigid Aluminium Flex And Assembly
An Example From This Sector
Boards from the production catalogue and the problem each had to solve. Customer names and volumes are confidential.
Guides For Computing And Embedded Buyers
Written for the engineering and purchasing decisions this sector runs into.
Layer count is the single decision that most affects the price and the electrical behaviour of a board. This guide sets ...
Three surface finishes cover almost every board we build. Choosing between them is not a quality decision, it is a fitne...
Design rules are usually set once and copied between projects. That is fine until a board needs to shrink, at which poin...
Computing And Embedded Questions
Can you build a sixteen layer board?
Yes. 1 to 16 layers is the published range on our rigid capacity table.
What panel size can you build for a large motherboard?
Up to 450 x 660 mm, which is 18 x 26 inches.
Do you fit sockets and slots?
Yes, and they are inspected as precision mechanical parts, not only as solder joints.
Send Us A Computing And Embedded Board To Price
Gerber or ODB++ with the layer count, thickness, copper weight, surface finish and quantity. Add the bill of materials if you want the board assembled as well.