ISO 9001 · ISO 14001 · UL
Assembled small form factor motherboard PCBA with memory slot expansion slot and rear port cluster
PCBA

Assembled Motherboard With Expansion Slot And Rear Port Cluster

An assembled motherboard in a small form factor, with a memory slot, an expansion slot, a processor socket, a rear port cluster and a standard power header. Computing boards combine high layer counts, tight impedance control and a great many mechanical parts on one panel.

Assembled small form factor motherboard PCBA with memory slot expansion slot and rear port cluster
Mini ITX Format Motherboard PCBA, photographed as built. Legacy catalogue reference PCBA-3.
Product overview

What This Board Is

A motherboard is the hardest thing on this catalogue to build well. The memory and expansion buses need controlled impedance, the socket has to be coplanar, the rear cluster has to line up with a chassis aperture, and the electrolytic capacitors have to survive a reflow profile set by the processor socket. Our published rigid capability covers 1 to 16 layers with a minimum trace and space of 0.075 mm, which is the envelope boards of this type sit inside.

  • PCBA
  • See specification
Key benefits

What You Get From This Build

  • Layer counts to 16 available for boards that need dedicated memory bus reference planes
  • Rear port cluster alignment controlled by an outline tolerance of ±0.10 mm
  • Sockets and slots placed and inspected as precision mechanical parts
  • Immersion gold keeps socket and slot contacts flat and free of oxide
Who it is for

Who Specifies This Board

  • Embedded computing and industrial PC manufacturers
  • Kiosk, signage and point of sale hardware builders
  • Single board computer developers moving from a reference design to their own layout
  • Systems integrators specifying a board to fit an existing chassis
Problems it solves

Four Failures This Build Is Designed Against

Each one is a real way this class of board goes wrong, and the tolerance or process decision that prevents it.

Impedance

Memory buses that fail at speed

Controlled impedance is designed into the stack-up before fabrication. Send the target values with the Gerber set rather than after the first article.

Chassis fit

Rear ports that miss the aperture

Outline dimension tolerance of ±0.10 mm and hole position of ±0.05 mm are held on the bare board so the cluster lands where the chassis expects it.

Socket coplanarity

Processor sockets that do not seat evenly

Panel warpage is held at 0.75% or better, which is what a socket needs to sit flat.

Component height

Tall capacitors fouling the chassis lid

Give the height restriction with the layout and it is checked at the placement stage, not at final assembly.

Specifications

Technical Specification

Product detail from the catalogue record, followed by the published process capability for the PCBA family. Anything the legacy catalogue did not record is marked TBC rather than filled in.

ItemTechnical specification
Product nameMini ITX Format Motherboard PCBA
Legacy catalogue referencePCBA-3
Product familyPCBA
Surface finishSee specification
Assembly technologySurface mount, through-hole and mixed technology
Substrates assembledRigid FR4, aluminium metal core and flexible circuits
Bare board testingOpen and short test at 50 to 300 V before assembly
Component sourcingTurnkey, consigned or mixed
Functional testTBC — quoted against your test specification
Conformal coatingTBC — confirm the coating specification with your enquiry
Minimum order quantityTBC — not recorded on the legacy catalogue
Lead timeTBC — confirmed per enquiry
Materials

What The Board Is Made Of

MaterialSpecification
Bare boardRigid FR4, aluminium metal core or flexible circuit, fabricated in the same plant
SolderLead-free process, RoHS compliant
ComponentsSupplied by us on turnkey, or consigned by you
StencilCut to the released paste layer of the same board revision
PackingPacked on our own packing machines to your specification
Customisation

What Can Be Changed

  • Turnkey, consigned or mixed component supply
  • Rigid, aluminium or flexible substrates
  • Mixed surface mount and through-hole builds
  • Hand-fitted magnetics and mechanical parts
  • Device programming, subject to confirmation
  • Packing to your goods-in specification
Manufacturing process

How This Board Is Made

Eight stages on equipment sourced from the USA, Japan, Germany and Israel. Every stage listed runs inside our own plant.

Data and BOM review

Manufacturer part numbers checked and alternates agreed in writing before buying.

Bare board

Fabricated in the same plant and open and short tested at 50 to 300 V.

Stencil

Cut to the paste layer of the same released revision as the board.

Paste and placement

Solder paste printed, then surface mount devices placed.

Reflow

Profiled for the substrate, with flexible circuits carried flat in tooling.

Through-hole and manual

Connectors, magnetics and hand-fitted parts as separate operations with their own inspection.

Inspection

Assembled boards inspected before packing.

Packing

Packed on our own packing machines to your goods-in specification.

Quality control

What Is Checked Before It Ships

  • Bare board open and short tested at 50 to 300 V before any component is placed
  • Stencil and board matched to the same released revision
  • Post-reflow inspection before through-hole and manual operations
  • Mechanical parts such as sockets and terminal blocks inspected as mechanical parts
  • Functional test quoted and run against your own test specification
Certifications

What The Plant Holds

  • ISO 9001:2000. Quality management system certification recorded by the company. Current revision year available on request.
  • ISO 14001:1996. Environmental management system certification recorded by the company.
  • UL. Certification recorded by the company. File number available on request.
  • RoHS and lead free. Listed in the company environmental policy alongside pollution prevention and resource reduction.

Certificate numbers, issue dates and current revision years are not published on the legacy site. Ask for copies with your enquiry and they will be sent with the quotation.

Comparison

How It Compares With The Alternatives

Three boards from our own catalogue, side by side, so the trade-off is visible rather than argued.

AssemblyTechnologyDistinguishing featureBest suited to
Mini ITX Format Motherboard PCBAHigh layer countSocket and expansion slotIndustrial PC and kiosk
Embedded Controller PCBA With MCU And SD CardFour to six layersHeaders and card socketMachine controllers
Multi Port Control PCBA With USB And Card SlotMainly SMDUSB and card slotGateways and media devices
Use guide

What To Send With Your Enquiry

Four things that decide whether the quote comes back right the first time.

  1. Send the impedance profile for the memory and expansion buses with the stack-up, before tooling.
  2. Give the chassis drawing showing the rear aperture, so the port cluster position can be verified.
  3. State the maximum component height allowed above the board on each side.
  4. Confirm whether the socket, heatsink and fan are fitted here or shipped separately.
Questions

Mini ITX Format Motherboard PCBA Questions

How many layers can you build for a computing board?

Our published rigid capacity table covers 1 to 16 layers.

Can you hold controlled impedance on memory buses?

Send the impedance profile with the stack-up and we will confirm it against available laminate thicknesses before tooling.

What is your maximum panel size?

450 x 660 mm, which is 18 x 26 inches, on the rigid line.

Do you supply boards with the heatsink and fan fitted?

Tell us the mechanical assembly you need. Mechanical parts are quoted separately from the electrical build.

Industries

Where This Board Is Used

The fields the legacy catalogue records for this class of board.

Get Mini ITX Format Motherboard PCBA Priced Against Your Own Files

Send Gerber RS-274X with an NC drill file, or an ODB++ package, with the layer count, thickness, copper weight, surface finish and quantity. We check it against the published capability before quoting.