ISO 9001 · ISO 14001 · UL
Ten layer rigid PCB on blue solder mask with immersion gold finish and multiple device sites
Industry application

Dense Digital Boards With Controlled Return Paths

Telecom boards are dense, they run fast, and they have to pass emissions testing. That combination pushes layer count up and design rules down. Our rigid line runs to 16 layers with 0.075 mm trace and space, which is the envelope most of this work sits inside.

Sector pain points

What Actually Fails In Telecommunication

Four failure modes specific to this sector, and the published figure that each one is controlled by.

Emissions

Emissions

A continuous inner ground plane gives every fast signal a short return path, which fixes most emissions problems before they reach the test house.

Escape routing

Escape routing

Multi-BGA designs consume routing layers just getting out of the package. Ten and twelve layer builds give those layers back.

Slot fit

Slot fit

Line cards go into a fixed slot pitch. Outline tolerance of ±0.10 mm and hole position of ±0.05 mm keep the card in its guides.

Connector wear

Connector wear

Cards that are re-seated during maintenance need electroplated gold, not immersion.

In context

An Example From This Sector

Boards from the production catalogue and the problem each had to solve. Customer names and volumes are confidential.

Questions

Telecommunication Questions

Can you hold controlled impedance?

Send the target impedance and tolerance per net with your stack-up and we will confirm it against available laminate thicknesses before tooling.

What is your highest layer count?

16 layers is the published limit on our rigid capacity table.

Do you build backplanes?

Twelve layer boards with edge connectors are in the catalogue and are the usual backplane construction.

Send Us A Telecommunication Board To Price

Gerber or ODB++ with the layer count, thickness, copper weight, surface finish and quantity. Add the bill of materials if you want the board assembled as well.