ISO 9001 · ISO 14001 · UL
Four layer immersion gold rigid PCB with fine pitch connector arrays and a BGA site
Rigid PCB

Four Layer Immersion Gold Board For Dense SMD Routing

A four layer FR4 board with an immersion nickel gold finish. The two inner layers are given over to a ground plane and a power plane, which frees both outer layers for routing and gives fine pitch devices a flat, planar surface to sit on.

Four layer immersion gold rigid PCB with fine pitch connector arrays and a BGA site
4 Layer Rigid PCB, photographed as built. Legacy catalogue reference 4 Layer.
Product overview

What This Board Is

Adding two inner layers changes what a board can do. Return currents get a continuous ground plane instead of a meandering trace, supply rails stop dropping voltage across the board, and the outer layers are freed up for signal routing. The board shown carries an array of fine pitch connector footprints and a BGA site, both of which need the flat surface that immersion gold provides and neither of which places reliably on a HASL crown.

Inner layers are imaged, etched and AOI checked before the MLB laminator presses the stack-up.

  • Rigid PCB
  • 4 layer
  • Immersion gold
  • RoHS
Key benefits

What You Get From This Build

  • Immersion gold is flat to within microns, so BGA and 0.4 mm pitch parts self-align during reflow
  • A dedicated ground plane cuts radiated emissions without adding shielding cans to the assembly
  • Gold over nickel does not oxidise, so boards can be stored and assembled in two separate batches
  • Four layers carry roughly twice the routing density of a two layer board in the same outline
Who it is for

Who Specifies This Board

  • Telecom equipment makers routing dense digital sections
  • Industrial control OEMs whose boards must pass EMC testing
  • Medical device manufacturers who need a stable, oxide-free finish for long storage
  • Anyone placing a BGA, QFN or fine pitch connector for the first time
Problems it solves

Four Failures This Build Is Designed Against

Each one is a real way this class of board goes wrong, and the tolerance or process decision that prevents it.

Placement

BGA balls that do not sit flat

Immersion gold gives a planar pad. There is no solder crown to tip the package, so the reflow self-alignment that BGA assembly depends on actually happens.

EMC

Radiated emissions failures late in the project

A continuous inner ground plane gives every high speed signal a short return path. Most emissions problems on two layer boards disappear when the same circuit moves to four layers.

Routing

Traces that will not fit in the outline

Minimum trace width and space are both 0.075 mm (3 mil), so escape routing from a fine pitch part fits without growing the board.

Storage

Oxidised pads after months in the warehouse

Gold does not oxidise. Boards can be built now and assembled later without a re-tinning step.

Specifications

Technical Specification

Product detail from the catalogue record, followed by the published process capability for the Rigid PCB family. Anything the legacy catalogue did not record is marked TBC rather than filled in.

ItemTechnical specification
Product name4 Layer Rigid PCB
Legacy catalogue reference4 Layer
Product familyRigid PCB
Layer count4 layer
Surface finishImmersion gold
RoHSRoHS compliant process, as recorded on the legacy catalogue
Layer count1 to 16 layers
Maximum panel dimension450 x 660 mm (18 x 26 in)
Minimum board thickness4 layers 0.40 mm (16 mil) / 6 layers 1.00 mm (40 mil) / 8 layers 1.20 mm (48 mil)
Minimum trace width0.075 mm (3 mil)
Minimum trace space0.075 mm (3 mil)
Minimum finished hole0.20 mm (8 mil)
Plated hole wall thickness0.025 mm (1 mil)
Plated hole diameter tolerance±0.075 mm (3 mil)
Non-plated hole diameter tolerance±0.05 mm (2 mil)
Hole position tolerance±0.05 mm (2 mil)
Outline dimension tolerance±0.10 mm (4 mil)
Minimum solder bridge0.10 mm (4 mil)
Warpage≤0.75%
Isolation resistance>1012 Ω at normal condition
Hole resistance<300 Ω at normal condition
Flammability rating94V-0 self-extinguishing
Open / short test voltage50 to 300 V
Materials

What The Board Is Made Of

MaterialSpecification
Base laminateFR4 glass reinforced epoxy, 94V-0 self-extinguishing
CopperWeight confirmed against the current your rails carry
Solder maskLPI solder mask, green as standard, other colours on request
LegendSilk screen legend ink, white as standard
Surface finishLead-free HASL, immersion nickel gold or electroplated nickel gold
Customisation

What Can Be Changed

  • Layer count from 1 to 16
  • Solder mask colour including blue and other colours
  • Legend colour
  • Lead-free HASL, immersion gold or electroplated gold
  • Copper weight to suit the current your rails carry
  • Delivery as singles, V-cut arrays or routed tab arrays
Manufacturing process

How This Board Is Made

Eight stages on equipment sourced from the USA, Japan, Germany and Israel. Every stage listed runs inside our own plant.

Film and tooling

Artwork plotted on a Mania 8850-P film plotter and the panel laid out for the order quantity.

Inner layers

Imaged, etched and checked before lamination, because a defect buried in the stack cannot be repaired.

Lamination

Cores and prepreg pressed on the MLB laminator to build the stack-up.

Drilling

Mania, Hitachi and domestic CNC drillers, thirteen machines in total, to a 0.20 mm minimum hole.

Plating

Desmear, automatic PTH line and graphic plating to a 0.025 mm barrel wall.

Mask and legend

Automatic screen printing and roller coating, then exposure and developing.

Surface finish

Lead-free HASL, immersion gold or electroplated gold according to the order.

Profile and test

CNC routing or V-cut to ±0.10 mm, then open and short testing at 50 to 300 V.

Quality control

What Is Checked Before It Ships

  • Inner layer inspection before lamination, because buried defects cannot be repaired
  • Open and short testing at 50 to 300 V on every board
  • Hole resistance verified below 300 Ω at normal condition
  • Isolation resistance verified above 1012 Ω at normal condition
  • Warpage held at ≤0.75% across the panel
Certifications

What The Plant Holds

  • ISO 9001:2000. Quality management system certification recorded by the company. Current revision year available on request.
  • ISO 14001:1996. Environmental management system certification recorded by the company.
  • UL. Certification recorded by the company. File number available on request.
  • RoHS and lead free. Listed in the company environmental policy alongside pollution prevention and resource reduction.

Certificate numbers, issue dates and current revision years are not published on the legacy site. Ask for copies with your enquiry and they will be sent with the quotation.

Comparison

How It Compares With The Alternatives

Three boards from our own catalogue, side by side, so the trade-off is visible rather than argued.

BoardLayers or buildFinishBest suited to
4 Layer Rigid PCB4Immersion goldFine pitch SMD with ground and power planes
2 Layer Rigid PCB2Lead-free HASLSimpler circuits at lower cost
6 Layer Rigid PCB6Lead-free HASLMore routing layers for larger controllers
Use guide

What To Send With Your Enquiry

Four things that decide whether the quote comes back right the first time.

  1. Send a stack-up drawing with the copper weight of each layer and the dielectric thickness between them.
  2. Mark which nets need controlled impedance and state the target value and tolerance.
  3. Keep BGA escape vias on the drill file rather than describing them in an email.
  4. Tell us if the board needs a gold thickness above our standard immersion deposit.
Questions

4 Layer Rigid PCB Questions

What is the minimum trace width and space you can hold?

0.075 mm, which is 3 mil, for both width and space. That figure is from our published rigid capacity table and applies to inner and outer layers.

Immersion gold or gold plating, which should I choose?

Immersion gold is flatter and better for fine pitch SMD. Electroplated gold is harder and better for contact surfaces such as edge fingers. Our 8 layer board uses gold plating for that reason.

Can you hold controlled impedance on four layers?

Send the target impedance and tolerance with your stack-up and we will confirm what the available laminate thicknesses allow before we tool the job.

How flat will the finished board be?

Warpage is held to 0.75% or better across the panel, which is the limit published in our rigid capacity table.

Get 4 Layer Rigid PCB Priced Against Your Own Files

Send Gerber RS-274X with an NC drill file, or an ODB++ package, with the layer count, thickness, copper weight, surface finish and quantity. We check it against the published capability before quoting.