ESD protective packaging for electronic components since Ganlong's Group started in tube extrusion
Two translucent clear plastic rectangular strips lying
Industry

ESD Packaging For Semiconductor And IC Distribution

IC distributors and semiconductor plants handle devices that are sensitive to electrostatic discharge, mechanical shock, and orientation changes during transit.

RoHS and ISO140015-15 day lead timeShenzhen
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IC distributors and semiconductor plants handle devices that are sensitive to electrostatic discharge, mechanical shock, and orientation changes during transit. SEWATE supplies anti-static packaging in the form of tubes, carrier tape, and reels, designed to maintain fixed orientation and ESD protection from the die house to the pick and place machine. Profiles are matched to DIP, SOIC, SOJ, PLCC, LCC, SOP, SSOP, TSSOP, QFN, MLF, LPCC, TO series, and sockets, with over a thousand open tools available for through-hole, SMT, and leadless packages.

Pain Points

What Goes Wrong in Semiconductor And IC Distribution

Devices arrive in random orientation, requiring manual sorting before assembly

Tube profiles that do not match the device body cause jams and shingling in high-speed feeders

Electrostatic discharge damage is detected only at incoming inspection, leading to rejected batches

Partial reels or tubes without traceable packaging complicate inventory and rework

Newly released packages lack available stock tube or tape profiles in standard catalogues

What Buyers Need

What Semiconductor And IC Distribution Buyers Need From Packaging

  • Fixed orientation packaging that loads reliably into tube and tape feeders without manual intervention
  • Consistent anti-static performance that does not degrade after handling or storage
  • Tolerance control tight enough to support high-speed automated loading on fine-pitch and small body devices
  • Repeatable supply from the same tooling to ensure lot-to-lot interchangeability
  • Support for both small and large order quantities from a single supplier with consistent lead times
Anti-static packaging used in semiconductor and ic distribution
Typical Scenarios

Typical Jobs in Semiconductor And IC Distribution

  • Re-packing bulk ICs into fixed-count anti-static tubes for distribution to downstream customers
  • Shipping tested semiconductors from an assembly and test facility to an end customer with full traceability
  • Storing buffer stock of high-risk allocation parts in anti-static tubes with consistent orientation
  • Converting a device from bulk to tape and reel packaging for integration into an SMT production line
  • Providing matching spare tubes for rework of returned or partially used reels to maintain process continuity
How a Project Runs

How a Semiconductor And IC Distribution Project Runs

  1. Submit device drawing, tube drawing, or a physical sample to match the exact profile
  2. Select material based on clarity, impact strength, and dimensional tolerance: PVC, PS, PC, PETG, or ABS
  3. Receive drawing for approval before tooling is cut, ensuring fit and function before production
  4. Mould making and tooling trial followed by 20-50 free sample tubes for fit and function testing
  5. Extrusion, cutting, anti-static treatment, plug fitting, and carton packing completed in-house
  6. Repeat orders run against approved tooling with 5-15 day lead time, depending on quantity
Delivery Capability

What Delivery Looks Like

Coiled strips of black plastic packaging featuring embossed geometric patterns
  • MOQ 10000 pieces for standard tube profiles
  • Samples delivered in 3-5 days, stock profiles in 5-15 days depending on quantity
  • Custom tooling: 25-day ARO for basic low volume, typically 4-6 weeks, 10-12 weeks for complex or high-volume tools
  • Weekly capacity 50000 pcs, monthly output of finished products 150 tons
  • Packing in cartons or to customer specification, T/T and L/C accepted
  • Shipped from Shenzhen, Guangdong, China
FAQ

Semiconductor And IC Distribution Questions

Can you match a package that has just been released?

Yes. Over a thousand open tools cover through-hole, SMT, and leadless packages including QFN, MLF, and LPCC. If no existing tool fits, a new profile is tooled from your drawing or a physical sample.

How tight is the tolerance for high speed loading?

Critical dimension control is within 5 mils on PVC and plus minus 2 mils, about 50 micron, on polycarbonate. The tighter grade is used where unattended loading must run without shingling.

Do you support both tube and tape and reel packaging?

Yes. Tubes are used for larger or heavier bodies. Carrier tape and reel is produced for high-volume SMT placement of small SMD parts. Both are manufactured in-house.

What certification do you hold?

RoHS compliance on all products, ISO14001 as the quality management system, and full compliance with the Sony environmental protection requirement.

Will you take small quantities?

Small and large orders are both handled. However, the standard tube MOQ is 10000 pieces due to the cost of extrusion changeover, which must be recovered through run length.

Packaging Specified Around Your Semiconductor And IC Distribution Parts

Send the device list with quantities and the receiving line type. A format and a lead time come back within 24 hours.