MX12R Semiconductor Inspection Microscope

Key Benefits

• Infinity color corrected optical system ensures consistent image quality across magnifications
• Tilting trinocular head with 0-35 degree adjustment allows ergonomic viewing for multiple operators
• 356mm x 305mm mechanical stage travel supports large wafers and FPD panels
• 0.001mm fine focus precision enables detailed inspection of microstructures and defects
• Electronic sextuple nosepiece with DIC slot allows rapid switching between 5X, 10X, 20X, 50X, 100X and DIC objectives
• Built-in 100-240V wide voltage system supports global power standards without external converters
• Long working distance BD semi-APO DIC and non-DIC objectives (20X, 50X, 100X) reduce risk of sample contact
• Reticle attachable eyepiece allows measurement and documentation directly in the field of view

Application Scenarios

• Inspection of semiconductor wafers and IC dies under bright field, dark field, and DIC modes
• Defect analysis on flat panel display substrates with large area coverage and high precision focus
• Quality control of photomask patterns using polarizing and DIC contrast techniques
• Failure analysis of microelectronic components with 100X objective and long working distance
• Documentation of surface features with reticle-equipped eyepiece and camera integration

Who It Is For

• Semiconductor fabrication and packaging lines
• Flat panel display (FPD) manufacturing and quality inspection teams
• Microelectronics research and development labs
• Failure analysis and reliability testing departments
• Precision manufacturing facilities requiring high-accuracy surface inspection

Problems It Solves

• Fixed focus mechanisms limit precision in detecting micro-scale defects on wafers and panels
• Non-adjustable heads force operators to strain or reposition the entire microscope
• Small stage travel restricts inspection of large substrates like FPD panels or wafers
• Lack of DIC or polarizing options reduces contrast for transparent or reflective surfaces
• Inconsistent optical correction across magnifications leads to misinterpretation of defects
• Single objective systems require frequent changes, slowing down inspection cycles

Technical Features

• Infinity color corrected optical system for consistent image quality at all magnifications
• Tilting trinocular head with 0-35 degree adjustment and 50-76mm interpupillary range
• High eye point wide field plan eyepiece PL10X/25mm with adjustable diopter and reticle attachment
• Electronic BD sextuple nosepiece with DIC slot for 5X, 10X, 20X, 50X, 100X and DIC objectives
• Long working distance BD semi-APO DIC and non-DIC objectives (20X, 50X, 100X) for safe inspection
• Low position coaxial focus mechanism with 35mm coarse range and 0.001mm fine precision
• Upper limit and tension adjustment for consistent focus control across magnifications
• 14 x 12 inch three-layer mechanical stage with 356mm x 305mm travel and clutch handle
• Glass plate for reflected light inspection and 495mm x 641mm electronic stage with 306mm x 306mm travel
• 3+L/50 μm repeated positioning accuracy on electronic stage for repeatable sample alignment
• BD reflected illuminator with electronic variable aperture, field diaphragm, and center adjustment
• Switchable bright field and dark field modes with filter and polarizing kit slots
• Built-in 100-240V wide voltage system for global power compatibility
• C-mount adapter options (0.5X, 0.65X, 1X) for camera integration

Specifications

Specifications are taken from the AMADA product data for this item. Confirm critical dimensions with us in writing before ordering.

Customization Options

• Tilting trinocular head with 0-35 degree adjustment for ergonomic viewing
• Optional long working distance objectives (20X, 50X, 100X) for safe inspection of fragile or high-profile samples
• Electronic stage upgrade from mechanical to 495mm x 641mm with 306mm x 306mm travel and 3+L/50 μm accuracy
• C-mount adapter options (0.5X, 0.65X, 1X) for camera integration
• DIC attachment and polarizing kit for enhanced contrast in transparent or reflective materials
• Reticle-equipped eyepiece for measurement and documentation

Comparison With Other Options

Use Guide

• Adjust the tilting head to 0-35 degrees before use to match the operator's eye level
• Set the interpupillary distance between 50mm and 76mm for proper binocular fusion
• Use the clutch handle on the mechanical stage for quick positioning, then fine-tune with the coaxial focus
• Select the correct objective and illumination mode (bright field, dark field, polarizing, DIC) based on sample type
• For high-precision work, use the 0.001mm fine focus control and lock the tension adjustment
• Attach the C-mount adapter to the trinocular port for camera integration, using 0.5X, 0.65X, or 1X as needed
• Use the polarizing kit and DIC attachment when inspecting transparent or anisotropic materials