ISO 9001 · ISO 14001 · UL
Single layer flex ribbon cable with parallel conductors folded into a Z and stiffened at both ends
Flex PCB

Single Layer Flex Ribbon With Parallel Conductors And End Stiffeners

A single layer polyimide ribbon carrying many parallel conductors, stiffened at both ends and folded into a Z to show its flexibility. This is the format used to connect two boards that move relative to each other, or that sit in different planes inside one housing.

Single layer flex ribbon cable with parallel conductors folded into a Z and stiffened at both ends
1 Layer Flex Ribbon Cable, photographed as built. Legacy catalogue reference 1 Layer(FPC).
Product overview

What This Board Is

Where the branched flex circuit replaces a harness, this ribbon replaces a flat cable assembly. Every conductor is etched at the same pitch along the full length, and both ends carry a stiffener so they seat properly in their connectors. The Z fold in the photograph is how the part actually installs: it takes up slack without putting a sharp crease in the copper.

Ribbons are etched from roll stock, coverlay laminated, then punched to the flat pattern.

  • Flex PCB
  • 1 layer
  • See specification
Key benefits

What You Get From This Build

  • Uniform conductor pitch over the whole length removes the crosstalk variation of a twisted bundle
  • Stiffeners at both ends give two reliable ZIF or LIF insertions from one part
  • Base copper is available from 9 to 70 µm, so the ribbon can carry signal or power
  • Folded installation absorbs mechanical tolerance between two boards without strain on either connector
Who it is for

Who Specifies This Board

  • Display and panel module integrators
  • Instrument makers connecting a front panel board to a main board
  • Equipment builders with hinged or sliding assemblies
  • Manufacturers standardising on one ribbon instead of several cable part numbers
Problems it solves

Four Failures This Build Is Designed Against

Each one is a real way this class of board goes wrong, and the tolerance or process decision that prevents it.

Cable management

Flat cables that snag or get pinched on assembly

A flex ribbon folds to a known shape and stays there. It does not wander inside the housing the way a loose cable does.

Connector damage

Ribbon ends that fray or delaminate at the contact

End stiffeners hold the contact area rigid, so repeated insertion does not damage the conductors.

Current capacity

A signal ribbon asked to carry supply current

Base copper thickness is selectable up to 70 µm, which lets one ribbon carry both signal and power.

Length tolerance

Ribbons that are slightly too short in the assembly

Outline tolerance is ±0.05 mm, so length is repeatable across the whole batch.

Specifications

Technical Specification

Product detail from the catalogue record, followed by the published process capability for the Flex PCB family. Anything the legacy catalogue did not record is marked TBC rather than filled in.

ItemTechnical specification
Product name1 Layer Flex Ribbon Cable
Legacy catalogue reference1 Layer(FPC)
Product familyFlex PCB
Layer count1 layer
Surface finishSee specification
Layer countSingle layer, double layer and multilayer
Base materialPI, FR4, PET
Base copper thickness9, 12, 18, 35 and 70 µm
Maximum board size406 x 610 mm (16 x 24 in)
Minimum hole, drilledφ0.1 mm (0.004 in)
Minimum hole, punchedφ0.5 mm (0.02 in)
Plated hole tolerance±0.05 mm (±0.002 in)
Minimum track width0.05 mm (2 mil)
Minimum track gap0.05 mm (2 mil)
Surface treatmentPlated or immersion tin, plated or immersion gold, OSP
Outline treatmentPrecise V-cut, punch, milled, laser outline
Outline tolerance±0.05 mm
CoverlayPI film and PET film lamination
Solder resist inksLPI soldermask, UV-cured soldermask, legend ink, peelable soldermask, carbon ink, silver paste
Peeling strength1.0 kgf/cm with adhesive copper, 0.5 kgf/cm with adhesiveless copper
Legend coloursMultiple silk-screen colours
Materials

What The Board Is Made Of

MaterialSpecification
Base materialPI, PET or FR4
Base copper9, 12, 18, 35 or 70 µm
CoverlayPI film or PET film lamination
Solder resistLPI, UV-cured, peelable mask, legend ink, carbon ink or silver paste
Adhesion1.0 kgf/cm with adhesive copper, 0.5 kgf/cm adhesiveless
Customisation

What Can Be Changed

  • PI, PET or FR4 base material
  • Base copper from 9 to 70 µm
  • Stiffeners in any number of positions
  • Plated or immersion tin, gold, or OSP
  • Carbon ink and silver paste contact printing
  • V-cut, punch, mill or laser outline
Manufacturing process

How This Board Is Made

Eight stages on equipment sourced from the USA, Japan, Germany and Israel. Every stage listed runs inside our own plant.

Material selection

PI, PET or FR4 base chosen against whether the part is soldered and how often it flexes.

Imaging and etching

Circuit etched to a 0.05 mm minimum track and gap.

Coverlay

PI or PET film laminated over the conductors with openings cut at the contact areas.

Stiffeners

Laminated where connector tails or component areas need to be held rigid.

Hole forming

Drilled to φ0.1 mm or punched to φ0.5 mm depending on the feature.

Surface finish

Plated or immersion tin, plated or immersion gold, or OSP.

Contact printing

Carbon ink or silver paste printed where a contact pad needs it.

Outline

Precise V-cut, punch, mill or laser to ±0.05 mm.

Quality control

What Is Checked Before It Ships

  • Peeling strength of 1.0 kgf/cm on adhesive copper and 0.5 kgf/cm on adhesiveless copper
  • Outline tolerance verified at ±0.05 mm after punching or laser cutting
  • Coverlay opening registration checked against the contact areas
  • Plated hole tolerance held at ±0.05 mm
  • Stiffener thickness checked against the connector insertion specification
Certifications

What The Plant Holds

  • ISO 9001:2000. Quality management system certification recorded by the company. Current revision year available on request.
  • ISO 14001:1996. Environmental management system certification recorded by the company.
  • UL. Certification recorded by the company. File number available on request.
  • RoHS and lead free. Listed in the company environmental policy alongside pollution prevention and resource reduction.

Certificate numbers, issue dates and current revision years are not published on the legacy site. Ask for copies with your enquiry and they will be sent with the quotation.

Comparison

How It Compares With The Alternatives

Three boards from our own catalogue, side by side, so the trade-off is visible rather than argued.

BoardLayers or buildFinishBest suited to
1 Layer Flex Ribbon Cable1See specificationBoard to board ribbon interconnects
1 Layer Flexible PCB1See specificationShaped and branched harness replacements
2 Layer Flexible PCB2See specificationFlex circuits with exposed contact pads
Use guide

What To Send With Your Enquiry

Four things that decide whether the quote comes back right the first time.

  1. Give the conductor count, the pitch and the exposed contact length at each end.
  2. State the contact side at each end. Ribbons are often specified with opposite side contacts.
  3. Mark the stiffener area and thickness for each end separately.
  4. Give the installed fold positions so we can check the bend radius against the copper thickness.
Questions

1 Layer Flex Ribbon Cable Questions

What copper thicknesses can I choose?

9, 12, 18, 35 and 70 micrometres, from our published flex capacity table.

How wide can a flex ribbon be?

Maximum board size on our flex line is 406 x 610 mm, which is 16 x 24 inches.

Can the contacts be on opposite sides at each end?

Yes, that is a common requirement. Mark the contact side clearly at both ends of the drawing.

What coverlay do you use?

PI film or PET film lamination. Polyimide is the default where the part is soldered.

Industries

Where This Board Is Used

The fields the legacy catalogue records for this class of board.

Get 1 Layer Flex Ribbon Cable Priced Against Your Own Files

Send Gerber RS-274X with an NC drill file, or an ODB++ package, with the layer count, thickness, copper weight, surface finish and quantity. We check it against the published capability before quoting.