Carrier Tape Types By Width, Pocket And Anti Static Level

Carrier Tape Is Defined By Width, Pocket Type And Anti Static Level

The carrier tape is a tape-shaped product with equidistant cavities for holding electronic components. Its width, pocket molding method and anti-static classification are determined by the component type and application. Common widths include 8mm, 12mm, 16mm, 24mm, 32mm, 44mm, 56mm, and 4mm for small components. The pocket is formed either by embossing (blistering) or die-cutting (punched). The anti-static level is classified as conductive, anti-static (static dissipative), or non-conductive.

Embossed Carrier Tape

Embossed Carrier Tape Forms Pockets By Stretching The Material

Embossed carrier tape uses a mold to partially stretch the base material, forming a concave pocket. This method allows custom pocket sizes to match specific component dimensions. The profile is formed during extrusion or embossing, and the pocket depth and shape are controlled to hold the component securely during handling and SMT placement.

Punched Carrier Tape Uses Die-Cutting For Transparent Or Perforated Pockets

Punched carrier tape is formed by die-cutting, creating penetrating or semi-transparent pockets. This method is used when visibility of the component is required or when the component needs to be secured without stretching the base material. The die-cutting process allows for consistent pocket alignment and indexing.

Anti Static Level Must Match The Component Sensitivity

The anti-static level of the carrier tape must match the ESD sensitivity of the component. Conductive tapes are used for highly sensitive devices. Anti-static (static dissipative) tapes are used for general-purpose components. Non-conductive tapes are used when electrical isolation is required. The material choice (PVC, PS/HIPS, PC, PETG, ABS) affects the anti-static performance.

Carrier Tape Works With Cover Tape To Form A Sealed Reel

The carrier tape is sealed with a cover tape (upper tape) to form a closed, protective structure. The cover tape is peeled off during SMT placement. The sealed tape ensures components are protected from dust, moisture, and mechanical shock during shipping and storage. The index positioning cavities on the carrier tape allow the pick and place machine to accurately locate and remove each component.

Width And Pocket Size Are Customized To Match The Device Profile

The width of the carrier tape and the size of the pocket are determined by the physical dimensions of the component. For example, a 4mm tape is used for small, high-density components. The pocket must hold the component without movement, and the index cavity must align with the pick and place machine’s feed mechanism. Custom tooling is required for non-standard profiles.

Material Choice Affects Performance And Compatibility

The base material (PVC, PS/HIPS, PC, PETG, ABS) is selected based on the component’s environmental and mechanical requirements. PVC offers good flexibility and ESD control. PS/HIPS is used for low-cost, low-sensitivity applications. PC and PETG provide higher strength and thermal resistance. ABS is used for mechanical durability. Each material has different anti-static properties and must be tested for compliance.