Product Category
Polyamide (PA) Hot Melt Adhesives
Polyamide hot melt adhesives in powder and resin form. PA gives the highest bonding strength of our range with an easy process and a wide application range, and is used for garment and shoe lamination, heat transfer and low pressure molding.
Melting Data In This Category
| Black Polyamide Resin | Melting Point: 165-182°C |
|---|---|
| Polyamide Hot Melt Powder | Melting range: 105-120 °C |
| Polyamide Hot Melt Adhesive Resin UA-G0175 | Melting Rang: 158-173°C |
Polyamide (PA) Hot Melt Adhesives - FAQ
Can this be supplied to a different particle size or specification?
Yes. Powder is supplied in standard cuts or to your requirement, and film thickness, width and length can be customised.
Can you send the technical data sheet?
Yes. Email [email protected] with the grade name and we will send the data sheet.
Which applications is this family used in?
Heat transfer printing, shoe materials, low pressure molding, filters, conveyor belts and automotive interiors, depending on the grade.
Do you supply other polymer families as well?
Yes - polyamide, thermoplastic polyurethane, polyester and polyolefin, in granule, powder and film form.
Get A Quotation On Polyamide (PA) Hot Melt Adhesives
Send the grade, the quantity and your process temperature.