Hot Melt Resin
Black Polyamide Resin
| Model | UA-G182C |
|---|---|
| Melting Point | 165-182°C |
| Viscosity | 5000-7000 mpas/210°C |
| Application | Low pressure injection molding （LPIM） |
| Color | Black |
Technical data sheet on request · Particle size, film specification and packing can be customised
About This Grade
Black Polyamide Hot Melt Adhesive
Black polyamide resin: polyamide hot melt adhesive UA-G182C is specialize designed for low pressure injection molding process. It’s as a viable solution for encapsulation and sealing in automotive, electrical and electronic industries.Such as tire pressure monitoring systems (TPMS), PCBs for seat occupant sensors, belt lock sensors, ECUs for motorcycles, air quality sensors, antennas for RF devices, smart entry (E-Key) systems, etc..
Topical Technical Date
Frequently Asked Questions
Can you send the technical data sheet for this grade?
Yes. Email [email protected] naming the grade and we will send the data sheet.
Can the specification be customised?
Yes. Powder particle cuts, film thickness, width and length and packing can be adjusted to your requirement.
Which substrates does it bond?
It depends on the polymer family - TPU grades give good adhesion to PVC, PU, fabric and genuine leather, polyamide bonds plastics such as PA 6.6, ABS and PVC, and polyolefin bonds PP, PE and PET.
How do we get a sample or a quotation?
Email us with the grade, the quantity and your process temperature and we will come back to you.
Ask About Black Polyamide Resin
Send the quantity and your process temperature and we will reply with a price and a data sheet.