Laboratory Vacuum Atmosphere Tube Furnace for Wafer Processing
This tube furnace is designed for sample preparation of various materials in a clean environment. The product uses a ring-shaped heating element outside the high-purity quartz vacuum chamber for uniform heating. It features high thermal efficiency, fast heating rates, and excellent temperature uniformity. The...
Introduction
This tube furnace for wafer processing is designed for sample preparation of various materials in a clean environment. The product uses a ring-shaped heating element outside the high-purity quartz vacuum chamber for uniform heating. It features high thermal efficiency, fast heating rates, and excellent temperature uniformity. The protective atmosphere circulates evenly inside, with forward and reverse flow, and high-temperature resistant seals are used at sealing points. The water-cooled stainless steel sealing system ensures safety and reliability.
The equipment is equipped with a complete automated touch-screen interface and includes over-temperature, thermocouple disconnection, and low water pressure alarm functions.
Main Features
- Large-diameter quartz vacuum chamber, capable of handling large-sized, thin sheet-like samples, with uniform heating from the ring-shaped heating element, ensuring excellent sintering results.
- Embedded operating system with a bilingual (Chinese/English) graphical interface, featuring a 7-inch color touch screen for intuitive operation and real-time curve tracking.
- Double-layer insulation structure with a wind-cooling interlayer.
- High-purity Al2O3 fiber refractory insulation material for maximum energy saving.
- High-purity alumina coating on the refractory furnace lining to extend service life.
- High-purity quartz furnace plug helps establish custom temperature gradients inside the tube.
- Complete over-temperature, thermocouple disconnection, and cooling water failure protection measures for safe operation.
- Interchangeable temperature measurement hole and observation window (select one).
Precautions for Equipment Use
1.The gas cylinder has a high internal pressure. When introducing gas into the furnace tube, a pressure reducing valve must be installed on the cylinder. It is recommended to select a small pressure reducing valve for experimental use, with a pressure range of 0.01MPa-0.15MPa, ensuring more accurate and safe operation.
2.When using this equipment for high-temperature sintering, a water chiller must be connected to the system to prevent the high-temperature sealing silicone rings from melting during operation.
Specifications
Figures below are the manufacturer data for this model. Anything not listed is confirmed in writing with the quotation rather than estimated here.
| Model | VA1200-20 |
|---|---|
| Power Supply | AC 220V 4KW |
| Max.temperature | 1200.C(<1 hour) |
| Long-Term Operating Temperature Range | 300~1150°C |
| Heating Rate | 1°C/H-20°C/Min |
| Heating Zone Dimensions | Φ190mm *200mm(suitable for 6” wafer processing. Bigger size for 8” wafer processing, can be customized) |
| Chamber Divider | Double-lay(optional) Wafer quartz holder can be customized |
| Intelligent Touch Screen Control System | Control mode: Embedded operating system with graphical interface in both Chinese and English, 7-inch color touchscreen input, intelligent human-machine dialogue mode Temperature curve setting: can store up to 15 temperature curves, each curve can be set with 30 segments of “time-temperature curve,” real-time monitoring, dynamically displaying the “time-temperature curve” Temperature calibration: Non-linear correction of the temperature difference between the temperature control temperature and the sample temperature throughout the system Equipment operation time recording: Sintering data storage, automatic report generation, real-time recording and retrieval System protection: Over-temperature alarm, thermocouple disconnection, cooling water failure, open circuit prompt, etc. |
| Gas Supply System | Uses a float-type flowmeter to control the gas flow rate, integrated with the equipment. The unit has been leak-tested before leaving the factory. Mass flow controller is optional |
| Pressure Measurement and Monitoring | Uses a mechanical pressure gauge with a gas-tight structure to effectively protect internal components from environmental impact and debris, while offering strong resistance to corrosion and high temperatures. |
| Temperature Accuracy | ±1°C |
| Heating Element | Ring-shaped heating element made of Mo-doped Fe-Cr-Al alloy, providing uniform and reliable temperature distribution. |
| Sealing System | Stainless steel sealing flange. Additionally equipped with an inlet, outlet, and vacuum interface. Vacuum: ≤10Pa (mechanical pump) |
| Dimensions | 780*580*600mm (W*H*D) |
| Net Weight | 60KG |
| Service Support | Two-year limited warranty with lifetime support (Warranty excludes consumable parts such as quartz chamber and O-rings). |
Laboratory Vacuum Atmosphere Tube Furnace for Wafer Processing In Detail
Processes This Unit Supports
These are the applications ZYLAB lists this model under. Each link opens the full equipment set for that process, which is useful when a project needs more than one machine.
Who Orders It
Fields this model already works in, plus what ZYLAB puts behind it: a 2-year warranty on most products, glass excluded, spare parts in stock and free application support by WhatsApp or email.
Related Projects
Related Equipment
Models from the same family and the same processes, in case a different chamber size or temperature range fits better.
Fluidized Bed Calcination Furnace for Powder and Fine Particle Materials
1200°C Dual-Zone Vertical Fluidized Bed CVD (FBCVD) Furnace with Automatic Feeding and Discharging System
Vertical High Temperature Tube Furnace – 1500°C / 1700°C for Laboratory and R&D
Vacuum Atmosphere Hybrid Box/Tube Furnace for Precision Heat Treatment
1200°C Hydrogen Rotary Tube Furnace for Metallurgical Research
Advanced Continuous Pyrolyzers for Biomass and Organic Solid Waste Thermal Processing & Sintering
1700°C Vertical Atmosphere Controlled Quenching Furnace for High-Performance Heat Treatment
Customizable Tube Furnace with Gas Control System – Precision Atmosphere Processing
Ordering Laboratory Vacuum Atmosphere Tube Furnace for Wafer Processing
What is Laboratory Vacuum Atmosphere Tube Furnace for Wafer Processing typically used for?
This tube furnace is designed for sample preparation of various materials in a clean environment. The product uses a ring-shaped heating element outside the high-purity quartz vacuum chamber for uniform heating. It features high thermal efficiency, fast heatin
How quickly can Laboratory Vacuum Atmosphere Tube Furnace for Wafer Processing be shipped?
Most standard ZYLAB models are held in stock. After testing and packing we normally ship Laboratory Vacuum Atmosphere Tube Furnace for Wafer Processing within 3 to 7 days. Customised builds are scheduled after the drawing is confirmed, and we give you the date in writing before the order is placed.
Is there a minimum order quantity for Laboratory Vacuum Atmosphere Tube Furnace for Wafer Processing?
No. ZYLAB has no minimum order requirement, so a single unit of Laboratory Vacuum Atmosphere Tube Furnace for Wafer Processing is a normal order. Occasionally a component supplier imposes a minimum quantity of their own, and we tell you as soon as we are notified.
Can we get technical help before ordering Laboratory Vacuum Atmosphere Tube Furnace for Wafer Processing?
Yes, and it is free. Our technical staff help with model selection, troubleshooting, manuals and application questions whether or not you have ordered from us before. Write to [email protected] or message us on WhatsApp.
What if Laboratory Vacuum Atmosphere Tube Furnace for Wafer Processing is damaged in transit?
Contact your ZYLAB sales engineer immediately with photographs. We arrange a substitute delivery promptly and handle the claim with the carrier.
Quote For Laboratory Vacuum Atmosphere Tube Furnace for Wafer Processing
Tell us the sample, the temperature and the atmosphere. You get the configuration, the price and the despatch date in one reply.