Capability
Tech Roadmap
Tech Roadmap
| Item | Current | 2013 | 2014 | |
|---|---|---|---|---|
| Max. Layer | 30 | 30 | 30 | |
| Track width/space | inner (mil) | 3 / 3 | 3 / 3 | 3 / 3 |
| Track width/space | outer (mil) | 3 / 3 | 4 / 3 | 3 / 3 |
| Aspect Ratio | 15 : 1 | 14 : 1 | 15 : 1 | |
| Copper Weight (oz) | 12 | 8 | 10 | |
| Impedance tolerance | ±5% | ±8% | ±5% | |
| Material | Microwave material | MP | SV | SV |
| Material | Via in pad | MP | SV | SV |
| Material | Lead-free | MP | MP | MP |
| Material | Mix lamination | MP | P | SV |
| Material | Metal Based/Core | MP | SV | SV |
| Material | HiTg | MP | MP | MP |
| HDI | 1+N+1 | MP | P | P |
| Buried resistance/electric capacity | MP | / | P |
P: Prototype SV: Small Volume MP: Mass Production
Work With SiYi Electronic
Quote in 1 day, no MOQ limited, prototypes and mass production both welcome.