Chinese HDI PCB Fab House · Founded May 2000 (86)0755-29704511 [email protected]
Aluminum Nitride Ceramic Substrate 5050 0.5mm ENIG – view 1Aluminum Nitride Ceramic Substrate 5050 0.5mm ENIG – view 2

Ceramic PCB

Aluminum Nitride Ceramic Substrate 5050 0.5mm ENIG

Base MaterialCeramic PCB
Board thickness0.50 mm
Min. Hole Size0.3 mm
Surface FinishingENIG
MaterialCeramic PCB
Supplier TypeOEM

Send Gerber on RS-274X and drill 3.3 metric trailing, zipped. Quote in 1 day.

Product Overview

Ceramic PCB is a kind of thermal conductive organic ceramic circuit board with a thermal conductivity of 9-20W/m.k prepared at a temperature below 250℃ by using thermally conductive ceramic powder and organic adhesive.

With the gradual deepening of electronic technology in various application fields, the highly integrated circuit board has become an inevitable trend. The highly integrated package module requires a good heat dissipation system, while the traditional circuit board FR-4 and CEM-3 are in TC (thermal conductivity) The disadvantage of) has become a bottleneck restricting the development of electronic technology. In recent years, the rapid development of the LED industry has also put forward higher requirements for the TC indicators of its load-bearing circuit boards. In the field of high-power LED lighting, circuit substrates are often prepared from materials with good heat dissipation properties such as metals and ceramics. The thermal conductivity of high thermal conductivity aluminum substrates is generally 1-4W/M. K, and the thermal conductivity of ceramic substrates depends on the method of preparation. Different from the material formula, it can reach about 220W/M. K.

Specifications

ItemSpecification
Base MaterialCeramic PCB
Board thickness0.50 mm
Min. Hole Size0.3 mm
Surface FinishingENIG
MaterialCeramic PCB
Supplier TypeOEM

Materials We Run

Rogers, Arlon, Taconic, TP-2, Megtron, Neclo, Isola, F4B, Taiyao TUC, Taiguang EMC, Tenghui VT, Shengyi SY, Lianmao ITEQ, Nanya NOUYA, DuPont Kapton, Taihong, Hongren, Xinyang, etc.

Surface Finishing

We have experience on processing HAL, LF-HAL, ENIG, Immersion Tin/Silver, Flash hard/soft gold, OSP surface finishing, SMOBC. Carbon Ink and Peel able Mask.

Quality Control

Outgoing inspection is carried out to IPC-A-600G or customer specification. Finished product complies with IPC-A-600 and IPC-6012.

EquipmentModelMade in
AOI TestorDiscovery8000Israel
AOI Overhaul StandVeriSmartIsrael
Special Testing MachineHV300China
Flying probe E-testorFX4000China
Impedance TestorTektronix DSA8200USA
Micro-section Analysis System/China

All inspection equipment

Aluminum Nitride Ceramic Substrate 5050 0.5mm ENIG — FAQ

What is Aluminum Nitride Ceramic Substrate 5050 0.5mm ENIG built on
Base material and full build data are listed in the specification table on this page, exactly as supplied by the factory.
What surface finish is used
ENIG. We also process HAL, LF-HAL, ENIG, Immersion Tin/Silver, Flash hard/soft gold, OSP and SMOBC, plus carbon ink and peelable mask.
What is the minimum hole size on this board
0.3 mm. Across the plant the smallest hole is 0.1mm with an aspect ratio of 16:1.
Can this board be customised
Yes. Supplier type is OEM and the plant runs 1~48 layer with no MOQ limited, so layer count, thickness, copper weight, solder mask colour and surface finish can all be changed to your drawing.
Is there a minimum order quantity
No MOQ limited. Prototypes, quick turn and high volume production are all accepted.
How fast can boards be delivered
At the fastest, 24hr for L2, 48hr for L4~L6 and 72hr for L8 or more. Monthly capacity is 30,000 sq.meter and 4,500 varieties.
How quickly will I get a quote
Quote in 1 day.
What file format should I send
Gerber RS-274×2.5 English leading and drill format 3.3 metric trailing, compressed as .rar or .zip. For quick CAM processing please send Gerber on RS-274X.

Send Your Drawing

Upload is not needed — email the zipped Gerber and drill files and an engineer will review them.

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